MIRA INFORM REPORT

 

 

Report Date :

20.12.2007

 

IDENTIFICATION DETAILS

 

Name :

SEMI CONDUCTOR LABORATORY

 

 

Formaly known as:

SEMI CONDUCTOR COMPLEX LIMITED

 

 

Registered Office :

Sector 72, S A S Nagar, Near Chandigarh-160071, Punjab

 

 

Country :

India

 

 

Financials (as on) :

31.03.2007

 

 

TAN No.:

[Tax Deduction & Collection Account No.]

PTLS16381B

 

 

PAN No.:

[Permanent Account No.]

AAGTS0959N

 

 

Legal Form :

Part of Department of Space

 

 

Line of Business :

Research Laboratory.

 

RATING & COMMENTS

 

MIRA’s Rating :

A

 

RATING

STATUS

PROPOSED CREDIT LINE

41-55

Ba

Overall operation is considered normal. Capable to meet normal commitments.

Satisfactory

 

Maximum Credit Limit :

USD 6614992

 

 

Status :

Good

 

 

Payment Behaviour :

Regular

 

 

Litigation :

Clear

 

 

Comments :

Subject is a part of Department of Space, Government of India. Lenders and Creditors can feel confident about its exposure. Payments are reported as slow but correct.

 

It can be considered good for business dealings at usual trade terms and conditions.

 

LOCATIONS

 

Registered Office :

Sector 72, S A S Nagar, Near Chandigarh-160071, Punjab, India

Tel. No.:

91-172-2236040/ 5027558

Mobile No.:

91-9872669118

Fax No.:

admissions@vedant.net, director@sclchd.co.in

Website :

http://www.sclindia.com

 

 

Branch :

Second Floor, Core 4, Scope Minar, Luxminagar, Delhi-110092, India

Tel. No.:

91-11-22432127

Fax No.:

91-11-22422732

 

DIRECTORS

 

Name :

Mrs. Veena S Rao

Designation :

Director

Date of Ceasing :

28.12.2005

 

 

Name :

Dr. R G Nadadur

Designation :

Director

 

 

Name :

Mr. K Nagachenchaiah

Designation :

Director

 

 

Name :

Mr. M M Sobti (Technical)

Designation :

Director

E-Mail :

mms@sclchd.co.in

 

 

Name :

Mr. S K Rakesh (Marketing)

Designation :

General Manager

E-Mail :

skr@sclchd.co.in

 

 

Name :

Mr. S B Sarna

Designation :

General Manager (Systems)

E-Mail :

sbs@sclchd.co.in

 

 

Name :

Mr. Manmohan Singh

Designation :

DGM (ITS)

E-Mail :

smm@sclchd.co.in

 

 

Name :

Mr. S K Ambardar

Designation :

Head (Facilities)

E-Mail :

ambardar@sclchd.co.in

 

KEY EXECUTIVES

 

Name :

Mr. Praveen Bangotra

Designation :

Scientist / Engineer, SE - ITSD

 

 

Name :

Mr. Vivek Trehan

Designation :

Company Secretary

 

BUSINESS DETAILS

 

Line of Business :

Research Laboratory.

 

PRODUCTION STATUS

 

Particulars

Unit

 

Installed Capacity

Actual Production

LSI/VLSI Wafers 6” processing

 

Quantity in millions

 

2

0.106

Chip on Board (COB) / ECB

 

Quantity in millions

 

250

36.000

Board Level Assembly/Sub-systems

Quantity in millions

 

20

5.051

VLSI Packaging

Quantity in millions

 

100

42.231

 

GENERAL INFORMATION

 

No. of Employees :

539

 

 

Bankers :

  • Andhra Bank
  • Canara Bank
  • Indian Bank
  • IDBI Bank Limited
  • State Bank of India
  • Union Bank of India
  • The Jammu & Kashmir Bank Limited
  • Punjab National Bank
  • Syndicate Bank

 

 

Facilities:

Secured Loan

 

Particulars

31.03.2007

 

 

Loans against Fixed Deposits

Rs.58.184 Millions

OCC Limit against Stock

Rs.4.691 Millions

Total

Rs.62.875 Millions

 

Banking Relations :

-

 

 

Auditors :

 

Name :

A K Sood and Associates

Chartered Accountants

Address :

S C O 50-51, 2nd Floor, Sector 17-A, Chandigarh, Punjab, India

 

CAPITAL STRUCTURE

 

Capital Investment :

 

Owned :

Rs.814.631 Millions

Borrowed :

-

Total :

Rs.814.631 Millions

 

FINANCIAL DATA

[all figures are in Rupees Millions]

 

 

ABRIDGED BALANCE SHEET

 

SOURCES OF FUNDS

 

 

 

31.03.2007

SHAREHOLDERS FUNDS

 

 

 

1] Share Capital

 

 

814.631

2] Share Application Money

 

 

0.000

3] Reserves & Surplus

 

 

839.117

4] (Accumulated Losses)

 

 

0.000

NETWORTH

 

 

1653.748

LOAN FUNDS

 

 

 

1] Secured Loans

 

 

62.875

2] Unsecured Loans

 

 

0.000

TOTAL BORROWING

 

 

62.875

DEFERRED TAX LIABILITIES

 

 

0.000

 

 

 

 

TOTAL

 

 

1716.623

 

 

 

 

APPLICATION OF FUNDS

 

 

 

 

 

 

 

FIXED ASSETS [Net Block]

 

 

382.361

Capital work-in-progress

 

 

10.931

 

 

 

 

INVESTMENT

 

 

0.000

DEFERREX TAX ASSETS

 

 

0.000

 

 

 

 

CURRENT ASSETS, LOANS & ADVANCES

 

 

 

 

Inventories

 

 

228.821

 

Sundry Debtors

 

 

255.116

 

Cash & Bank Balances

 

 

1154.225

 

Other Current Assets

 

 

76.291

 

Loans & Advances

 

 

139.220

Total Current Assets

 

 

1853.673

Less : CURRENT LIABILITIES & PROVISIONS

 

 

 

 

Current Liabilities

 

 

530.342

 

Provisions

 

 

0.000

Total Current Liabilities

 

 

530.342

Net Current Assets

 

 

1323.331

 

 

 

 

MISCELLANEOUS EXPENSES

 

 

0.000

 

 

 

 

TOTAL

 

 

1716.623

 

PROFIT & LOSS ACCOUNT

 

PARTICULARS

 

 

 

31.03.2007

Sales Turnover

 

 

407.311

Other Income

 

 

0.000

Total Income

 

 

407.311

 

 

 

 

Profit/(Loss) Before Tax

 

 

0.000

Provision for Taxation

 

 

0.000

Profit/(Loss) After Tax

 

 

0.000

 

 

 

 

Imports :

 

 

 

 

Raw Materials

 

 

15.315

 

Stores & Spares

 

 

2.575

 

Others

 

 

0.000

Total Imports

 

 

17.890

 

 

 

 

Expenditures :

 

 

 

 

Raw Material Consumed

 

 

98.164

 

Purchases made for re-sale

 

 

4.407

 

Consumption of stores and spares parts

 

 

48.287

 

Increase/(Decrease) in Finished Goods

 

 

2.130

 

Salaries, Wages, Bonus, etc.

 

 

87.717

 

Managerial Remuneration

 

 

31.326

 

Payment to Auditors

 

 

6.667

 

Interest

 

 

9.006

 

Insurance Expenses

 

 

7.324

 

Power & Fuel

 

 

4.611

 

Depreciation & Amortization

 

 

107.672

Total Expenditure

 

 

407.311

 

KEY RATIOS

 

PARTICULARS

 

 

 

 

31.03.2007

PAT / Total Income

(%)

 

 

N.A.

 

 

 

 

 

Net Profit Margin

(PBT/Sales)

(%)

 

 

N.A.

 

 

 

 

 

Return on Total Assets

(PBT/Total Assets}

(%)

 

 

N.A.

 

 

 

 

 

Return on Investment (ROI)

(PBT/Networth)

 

 

 

N.A.

 

 

 

 

 

Debt Equity Ratio

(Total Liability/Networth)

 

 

 

0.35

 

 

 

 

 

Current Ratio

(Current Asset/Current Liability)

 

 

 

3.49

 

LOCAL AGENCY FURTHER INFORMATION

 

DOS, the Administrative Ministry is in the process of restructuring the company and as part of this exercise, a Society “Semi-Conductor Laboratory” has been formed by DOS under the Societies Registration Act, 1860. All the assets and liabilities of Semiconductor Complex Limited will be transferred to Semi-Conductor Laboratory for which necessary approval from the Competent Authority has been obtained. The shareholders of the Company & Members of the Society have also approved the same in their meeting(s) held on 18th November 2005 and 8th December 2005 respectively. Pursuant to the approval of the cabinet in its meeting held on 23rd February 2006 the Semiconductor Complex Limited will be wound-up voluntarily as per the provisions of the Companies Act, 1956.

 

Website Details :

 

SCL-LEADING INDIA'S EFFORT IN MICROELECTRONICS

                          

Subject has always been in sync with the future. It has understood and appreciated the needs of India, its people and its ever-growing industry. The last over 20 years tell the saga of Subject's contribution in leading the national effort in the vital areas of microelectronics.

  

Subject was set-up in 1983, in the green, unpolluted environs on the outskirts of Chandigarh - a city designed by the French architect Le Corbusier, just 250 Kms northwest of the Indian Capital New Delhi. With its objective to design, develop and manufacture VLSIs and VLSI based systems and sub systems, and to create a strong R and D base, Subject entered into a technical collaboration with American Microsystems Inc. USA and in 1984 commenced commercial production in 5 micron CMOS technology. Through intensive in-house R&D efforts Subject developed and productionised the next generation 3 micron, 2 micron, 1.2 micron as well as EEPROM and CCD technologies. More recently, the company has established the 0.8 micron CMOS technology at its modern 6" wafer fabrication facility. The company has over the years developed and manufactured a number of key VLSIs for the Telecom and Industrial sectors.


Subject's vertically integrated semiconductor operations offer design, wafer fabrication, testing, packaging, quality assurance and reliability testing, VLSI based system manufacturing and applications support all under one roof. Within this framework, Subject places a lot of emphasis on its semiconductor operations - consistently building on its specialization in areas like Mixed Signal Devices, Micro power Technology, Digital Signal Processing, etc. This fulfils the demand of its customers in focus areas without ignoring its growing base of customers in consumer and industrial electronics.


From single chip to total solutions, Subject is a one-stop microelectronics organization. Subject offers its customers total solutions by providing Standard/Application Specific Standard Products (ASSPs), designing chips from concepts and creating products around ASICs. Add to this the technical service support, the customers have remarkable flexibility to interact with Subject at any stage.

 

VLSI-The Core of ModERn Electronic Systems

 

A semiconductor "chip", or integrated circuit, is a fingernail-size piece of silicon layered precisely with circuitry. These tiny chips are the enablers of the Information Age, powering the electronic marvels that have changed the world so dramatically. As the world becomes increasing technology savvy, the demand for semiconductor IC's is growing.

 

Much of this demand growth can be attributed to three main drivers for the advanced chips: communications, consumer applications and computing. Practically, an integrated circuit is a collection of large number of transistors (generally MOS transistor) fabricated on a single piece of Silicon (called die). These transistors are arranged and interconnected in such a way that they all together perform desired functionality. This art and science of putting large number of transistors onto small silicon is called (VLSI) Very Large Scale Integration. Selectively doping and metal layering pure silicon wafers in special factories called "fabs" or fabrication plants make IC's. Often referred to as the most sophisticated manufacturing plants in the world, advanced fabs typically cost around a billion dollars to build and equip. Today, there are approximately 900 fabs around the world producing millions of chips every year.

 

SCL Fabrication Facility at SAS Nagar

 

But before fabrication, circuit design pattern on silicon needs to be defined i.e. the areas on silicon which will be processed should be clearly marked out and remaining areas be masked off. The whole process from specifications of the required IC to finally generating the masking (or unmasking) areas position data is known as VLSI Design. VLSI design is further segmented into "Front end design" and "Back end design". Since the number of transistors (or MOS devices) is too large to be handled manually, a number of EDA (Electronic Design Automation) tools are used for performing the various VLSI design tasks.

 

India has been known worldwide as a country of highly professional and gifted IT professionals. Recognizing this fact, major global semiconductor companies like IBM, Philips, Analog Devices, Motorola, Cypress Semiconductor, Texas Instruments, ST Microelectronics, Cadence, MOS Chip Semiconductor, Alliance Semiconductor, Core EL Logic, Lucent Technologies, Sage Design, Infineon Technologies, Wipro Limited and many more MNCs have established their Design Houses in India. There is an ever-growing need at both Indian and MNCs to hire more VLSI design professionals to develop standard IP (Intellectual Property) cores and customized solutions for an ever-growing worldwide base of customers. Besides these, in more technology-friendly countries like USA and Japan, there is a growing dependence on India for skilled manpower to work on VLSI-design related activities.

 

 

ROAD TRAVEL

 

To travel by bus from New Delhi to Chandigarh a large number of buses operate from ISBT Kashmiri Gate Maharana Pratap Bus Stand, State Government Transport Undertakings from Haryana, Punjab, Chandigarh and Himachal Pradesh ply buses on Chandigarh route. On reaching Sector 17 ISBT one can use bus route no 13-C from Chandigarh to Sector 71 Phase-8 Mohali. Local bus stand is located adjacent to the main bus stand. Auto-Rikshaw service is also available from Chandigarh to SCL Mohali.

 

 

 

Introduction:

 

Semiconductor complex limited was established as a company in 1983 under the companies Act, 1956, to achieve self-reliance in the strategic area of Integranted circuit technology / micro-electronics. Company was meeting the microelectronics requirement of the country in a limited way. In 2002, the company was identified as the national foundry for MEMS under the national programme on smart materials.

 

Subject company was not in a position to make profit due to low volume of business and it was unviable to operate the company purely on commercial considerations given the difficulties faced by it in terms of:

 

Since the volume of business was not adequate, the company was incurring losses, leading to depletion of its working capital and operational capability.

 

The Government of india transferred administrative control of the company from the department of information technology to the department of space effective from March 01, 2005, In order to restructure the company and to have synergy with the indian space research organization, the department of space formed Subject as a society and registered the same on November 08.2005, under the societies registration Act, 1860, as amended by the punjab amendment Act, 1957, with emphasis on research and development in the field of microelectroics. The Subject society become operation from September 01.2006, with all assets and liabilities, tangible or intangible, movable or immovable, contingent or otherwise, including all rights, obligations, commitments, lien, contract, agreements, memoranda of understanding, whatsoever, transferred to it. The Subject company is being wound up voluntarily as per the provision of the compaies Act, 1956.

 

The main objective of the society as enshrined in its memoradum of association is to undertake, aid promote guide and coordinate reserch in the field of semiconductor technology, Micro electro mechanical systems and process technologies relating to subject processing.

 

The society in line with the objectives, carried out its activities upon becoming operational on 01.09.2006.

 

Technical Activities:

The technical activities of Subject are carried out in the following areas:

 

 

A brief on each of the above activities carried out during the perioed is given as under:

 

VLSI and MEMS Fabrication, Assembly and Testing

In the VLSI division, the development and manufacturer of ASICs continued to be the major thrust. About 40.000 MANAS chips were manufactured and delivered to SINP, Kolkata for used in an international project at CERN, Geneva. Phase – I of a Read out integrated circuit (8*8 ROIC array) for quantum well infrared photo detector (QWIP) has been completed. Wafer production for supply of a set of ASICs have been qualified for usage in the locomotive control applications. Processing of wafer lots for FTI and TDI devices also continued.

 

Activities for the development of MEMS based products were continued. Development of RFMEMS and design of newer versions of pressure sensore for low pressure applications were initiated. Work on the qualification of new MEMS processes was continued. Packaging and delivery of FM TTL clock driver devices (1W and 3W) to SAC Ahmedabad was completed.prototype phase of CCDs namely TDI and FTI for SAC, Ahmedabad and LEOS, Bangalore respectively has been completed.

 

Process qualification for diode array encapsulation project has been completed and FM device assembly will be taken up in due course. Ceramic assembly line has been qualified by ISAC for assembly of flight model devices and assembly of these devices for qualification is under progress. After the packaged devices are qualified, ISAC has plans to get the packaging of various FM devices at Subject . It is envisaged that packaging pf 125k Qaw – ECBs shall be completed during the current financial year and 200k are projected for next financial year.Packaging of various other devices such as PSP for BEL., Softdas (Data Capture from sensors for On-Board Launch Vehicle Applications), ADC (Analog to Digital Converter), DAC (Digital to Analog Converter), PCA (Protocol Controller ASIC), SPIC (Stage Processing IC), SRAM for VSSC, VPL (Video Processing Logic), Timing Sequencer RAD Hard, RTX Glue Logic, etc. Would also be complted during the year. Assembly of Hi-Reliability electronic packages for space Hardware Boards has commenced and would continue in the following years.

 

R and D Process Development:

 

 A0.8 Micro radiation hardened proces is being developed. A prototype circuit, namely sequernce controller has been fabricated. Pre – rad testinh of the device exhibited larghe off-state leakage current which was process related. In order to avoid this leakage, a new making step has been designed and introduced in the fabrication process flow. A new batch of sequence controller is being fabricated using this modified process flow. Radition tolerant device structures such as extended and enclosed gate transistirs have been fabricated in converntional process and these structure have been found to be radiation tolerant up to 60 krad (si).

 

Fabrication of test chip containing structure for characterizing high resstance poly silicon in the standard 0.8 mircon process is underway.

 

The process for area CCD image sensor has been finalized and prototype IK*IK frame transfer lmaging devicess have been developed. Of the two type of developed. Of the two and of devices developed, Viz.. MPP and conventional device, the latter has been selected for flight model development. Trial lots with process and mask modification to identify the specific are being fabricated. A feasibility study of 0.8 micro proces for the development of CMOS based imagers is underway.

 

Reliability and Quality Assurance:

 

Reliability and Quality Assurance Division has been set up to enhance the scope of reliability and quality assurance activities including environment testing of devices manufactured in-house as well screening and qualification of devices /sub systems as per MIL STD – 883/Space grade requirements. In-process quality Audits, Failure Analysis, Reliability Prediction; Implementation of ESD control Programme’ Quality Control and qualification of assembly, Packaging, Test and Screering Process, Calibration of Equipment and incomming material inspection activities and documentation are the major activitiesundertaken. The division completed screening of 500 flight worthy clock driver devices for the space programme and steps have been taken to enhance the screening capacity by almost tenfold for Railway ASICs. Long TDI imager devices to conduct constant acceleration test at 10.000g is another major initiative taken up with LPSC.

 

IT Services

Information Technology Services Division (ITSD) offers in –house IT services, IT Projects Marketing and coordination services for hardware software solutions and education and training programme.

 

ITSD implemented the integrated access control (Tripod Turnsile gates) and Time attendance system. The Smart Cards for the employees were personalized and printed in house. This system has been extended to the students and visitors etc. Plastic cards were also personalized and issued under the medical scheme. Activities relating to administrative and maintenance of intranet email servicess were continued. Proposal to upgrade the network backbone has been initiated. The existing web site of the society has been revemped to reflect the change after restrucring of SCL from company to society. A proposal to install and maintain an X-Ray Baggage inspection system is under implementation.

 

ITSD also excuted a project of smart card based access contrial system for 52 district officers of Food corporation of india  as part of IT projects marketing and coordination services. Discussions were also continued with ministry of overseas indian affairs for smart cart based e-governance solution for emigrants of pilot project for multipurpose National ID card.

 

As part of its education and training programme, ITSD offers courses in VLSI design and industrial training programme for engineering and management students. A number of studenthave been placed in various reputed companies after compus interviews.

 

Technical Support Services:

 

The Technical Support services under the facilities division of SCL essentially comprise of various utilities meeting requipmrnt of production and other areas. Ultra High pure systems (DI Water, Bulk Gases – N2, O2, H2, Specialty gases), Air management system for clean rooms and other areas., facilities control and monitoring systems (FCMS) for monitoring and controlling clean room parameters on a real time basis, electrical (Dedicated 66kv supple for reible power with minimal brown-outs and power outges), Clean Compressed DRY Air Process Vacuum System, Exhaust and Gas abatement System, Waste Management System and fire and safety System are the major utility plants systems in the society.

 

All the utilities plants sytem are operated on a 24*7*365 basis to cater to the needs of wafer fabrication operation which require continuous supply of various utilities. The maintenance activities encompassing preventive, predicitive and breakdoen maintenance were carried out as per the set schedule utilizing mostly the in-house resoueces. Apart from the operations and maintenance of the above plants systems, provision of utilities in new facilities like screening, Hi – Reliability fabrication etc. was made in line with defined quqlity standards.

 

All the fire fightinh detection insta;llations were periodically checked for their smooth and reliable operations. Mock fire drills were conducted by the fire wing personnel. Refreshre course on fire and safty aspects were Conducted for the employees on a regular basis. For Setting up of in – house fire wing, training was imparted to about 24 employees who had opted to join fire services wing.

 

Housing

 

The foundation stone of the SCL housing complex silicon enclave was laid by the chirman, SCL management council/Secretary, Deptt. Of Space on july 28, 2007, After approval of the plants by the local authority, Construction activity would be initiated in a phased manner.

 

 

Welfare Schemes

 

The Vikram A. Sarabhai Trust (VAST) under the agis of the department of space extended the VAST insurance scheme, Whenever Accident Strikes (VISWAS) and the scheme for assistance to families in exigency (SAFE) to the society employees. Most of the society employees have joined these schemes.

 

 

Capitalisation:

 

Government of india, Dept. of Space has released grants:

Revenue grant of Rs.270.000 Millions for the year 2006-07 (out of this Rs.70.000 Millions received during the perioed 01.09.2006 to 31.03.2007)

Capital grants of Rs.772.000 Millions received during 01.04.2006 to 31.03.2007 for augmentation/up gradation of micro electronics fabrication out of which Rs.2.687 Millions has been utilized and balance unutilized grant of Rs.769.313 Millions along with intrest thereon of Rs.67.339 Millions has been depicted in schedual No.2 of the balance sheet.

 

Preamble

Subject - formerly known as Semiconductor Complex Limited, established in 1983) is now a Society (registered on 08.11.2005 under the Societies Registration Act, 1860, as amended by Punjab Amendment Act, 1957), with the main objective to undertake, aid, promote, guide and co-ordinate Research and Development in the field of semiconductor technology, Micro Electro Mechanical Systems and process technologies relating to semiconductor processing.


Subject through its in-house R and D efforts  has developed 3 micron, 2 micron, 1.2 micron and 0.8 micron CMOS technologies as well specialized technologies such as EEPROM and CCD. SCL has over the years developed and supplied a number of key VLSIs, majority of which have been Application Specific Integrated Circuits (ASICs) for high reliability and industrial applications.

 

 

Vision

 

 

 

 

 

Composition of the Society

 

Department of Space, Bangalore = President

 

Department of Atomic Energy, Mumbai = Member

 

Department of Information Technology, New Delhi  = Member

 

       Department of Defence Research and Development, New Delhi = Member

 

       Department of Space, Bangalore  = Member

 

Semi-Conductor Laboratory, Chandigarh = Member

 

 

Vikram Sarabhai Space Centre, Thiruvananthapuram = Member

 

Central Electronics Engineering Research Institute (CEERI), Pilani = Member

 

Deptt. of Electronics and Telecommunications Engineering,
Indian Institute of Technology, Kharagpur
= Member

 

Composition of the Management Council

 

Department of Space, Bangalore = Chairman

 

Semi-Conductor Laboratory, Chandigarh  = Member

 

Department of Atomic Energy, Mumbai  = Member

 

Department of Defence Research and Development, New Delhi  = Member

 

Department of Space, Bangalore = Member

 

DOQR/ISRO HQs., Bangalor = Member

 

Defence Research and Development Organisation, Bangalore = Member

 

Semi-Conductor Laboratory, Chandigarh  = Member

 

      MVIT/VSSC, Thiruvananthapuram = Member

 

 

Fixed Assets:

 

 

 


CMT REPORT (Corruption, Money Laundering & Terrorism]

 

The Public Notice information has been collected from various sources including but not limited to: The Courts, India Prisons Service, Interpol, etc.

 

1]         INFORMATION ON DESIGNATED PARTY

No exist designating subject or any of its beneficial owners, controlling shareholders or senior officers as terrorist or terrorist organization or whom notice had been received that all financial transactions involving their assets have been blocked or convicted, found guilty or against whom a judgement or order had been entered in a proceedings for violating money-laundering, anti-corruption or bribery or international economic or anti-terrorism sanction laws or whose assets were seized, blocked, frozen or ordered forfeited for violation of money laundering or international anti-terrorism laws.

 

2]         Court Declaration :

No records exist to suggest that subject is or was the subject of any formal or informal allegations, prosecutions or other official proceeding for making any prohibited payments or other improper payments to government officials for engaging in prohibited transactions or with designated parties.

 

3]         Asset Declaration :

No records exist to suggest that the property or assets of the subject are derived from criminal conduct or a prohibited transaction.

 

4]         Record on Financial Crime :

            Charges or conviction registered against subject:                                                  None

 

5]         Records on Violation of Anti-Corruption Laws :

            Charges or investigation registered against subject:                                                          None

 

6]         Records on Int’l Anti-Money Laundering Laws/Standards :

            Charges or investigation registered against subject:                                                          None

 

7]         Criminal Records

No available information exist that suggest that subject or any of its principals have been formally charged or convicted by a competent governmental authority for any financial crime or under any formal investigation by a competent government authority for any violation of anti-corruption laws or international anti-money laundering laws or standard.

 

8]         Affiliation with Government :

No record exists to suggest that any director or indirect owners, controlling shareholders, director, officer or employee of the company is a government official or a family member or close business associate of a Government official.

 

9]         Compensation Package :

Our market survey revealed that the amount of compensation sought by the subject is fair and reasonable and comparable to compensation paid to others for similar services.

 

10]        Press Report :

            No press reports / filings exists on the subject.

 

 

CORPORATE GOVERNANCE

 

MIRA INFORM as part of its Due Diligence do provide comments on Corporate Governance to identify management and governance. These factors often have been predictive and in some cases have created vulnerabilities to credit deterioration.

 

Our Governance Assessment focuses principally on the interactions between a company’s management, its Board of Directors, Shareholders and other financial stakeholders.

 

 

CONTRAVENTION

 

Subject is not known to have contravened any existing local laws, regulations or policies that prohibit, restrict or otherwise affect the terms and conditions that could be included in the agreement with the subject.

 

 

FOREIGN EXCHANGE RATES

 

Currency

Unit

Indian Rupees

US Dollar

1

Rs.39.55

UK Pound

1

Rs.79.62

Euro

1

Rs.57.02

 

 

SCORE & RATING EXPLANATIONS

 

SCORE FACTORS

 

RANGE

POINTS

HISTORY

1~10

7

PAID-UP CAPITAL

1~10

7

OPERATING SCALE

1~10

7

FINANCIAL CONDITION

 

 

--BUSINESS SCALE

1~10

9

--PROFITABILIRY

1~10

6

--LIQUIDITY

1~10

7

--LEVERAGE

1~10

7

--RESERVES

1~10

7

--CREDIT LINES

1~10

7

--MARGINS

-5~5

-

DEMERIT POINTS

 

 

--BANK CHARGES

YES/NO

YES

--LITIGATION

YES/NO

NO

--OTHER ADVERSE INFORMATION

YES/NO

NO

MERIT POINTS

 

 

--SOLE DISTRIBUTORSHIP

YES/NO

NO

--EXPORT ACTIVITIES

YES/NO

NO

--AFFILIATION

YES/NO

YES

--LISTED

YES/NO

NO

--OTHER MERIT FACTORS

YES/NO

YES

TOTAL

 

64

 

This score serves as a reference to assess SC’s credit risk and to set the amount of credit to be extended. It is calculated from a composite of weighted scores obtained from each of the major sections of this report. The assessed factors and their relative weights (as indicated through %) are as follows:

 

Financial condition (40%)            Ownership background (20%)                 Payment record (10%)

Credit history (10%)                    Market trend (10%)                                Operational size (10%)

 


 

RATING EXPLANATIONS

 

RATING

STATUS

 

 

PROPOSED CREDIT LINE

>86

Aaa

Possesses an extremely sound financial base with the strongest capability for timely payment of interest and principal sums

 

Unlimited

71-85

Aa

Possesses adequate working capital. No caution needed for credit transaction. It has above average (strong) capability for payment of interest and principal sums

 

Large

56-70

A

Financial & operational base are regarded healthy. General unfavourable factors will not cause fatal effect. Satisfactory capability for payment of interest and principal sums

 

Fairly Large

41-55

Ba

Overall operation is considered normal. Capable to meet normal commitments.

 

Satisfactory

26-40

B

Unfavourable & favourable factors carry similar weight in credit consideration. Capability to overcome financial difficulties seems comparatively below average/normal.

 

Small

11-25

Ca

Adverse factors are apparent. Repayment of interest and principal sums in default or expected to be in default upon maturity

 

Limited with full security

<10

C

Absolute credit risk exists. Caution needed to be exercised

 

 

Credit not recommended

NR

In view of the lack of information, we have no basis upon which to recommend credit dealings

No Rating

 

 

PRIVATE & CONFIDENTIAL : This information is provided to you at your request, you having employed MIPL for such purpose. You will use the information as aid only in determining the propriety of giving credit and generally as an aid to your business and for no other purpose. You will hold the information in strict confidence, and shall not reveal it or make it known to the subject persons, firms or corporations or to any other. MIPL does not warrant the correctness of the information as you hold it free of any liability whatsoever. You will be liable to and indemnify MIPL for any loss, damage or expense, occasioned by your breach or non observance of any one, or more of these conditions