MIRA
INFORM REPORT
|
Report Date : |
07.08.2008 |
IDENTIFICATION
DETAILS
|
Name : |
SI2 MICROSYSTEMS LIMITED |
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Formerly Known As : |
SUN ELECTRONICS TECHNOLOGIES LIMITED |
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Registered Office : |
No. 52/A, 1st Cross, 3rd Main, KIADB
Industrial Area, Hoskote, Bangalore – 562114, Karnataka, India |
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Country : |
India |
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Financials (as on) : |
31.03.2007 |
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Date of Incorporation : |
08.12.1993 |
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Com. Reg. No.: |
08-15018 |
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CIN No.: [Company Identification No.] |
U85110KA1993PLC015018 |
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TAN No.: [Tax Deduction & Collection Account No.] |
BLRS03206A |
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PAN No.: [Permanent Account No.] |
AACCS0375D |
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Legal Form : |
A closely held public limited liability company |
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Line of Business : |
Manufacturer and exporter of scientific equipments,
research instrument required in the field of electronics and vacuum
technology. |
RATING
& COMMENTS
|
MIRA’s Rating : |
Ba |
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RATING |
STATUS |
PROPOSED CREDIT LINE |
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41-55 |
Ba |
Overall operation is considered normal. Capable to meet
normal commitments. |
Satisfactory |
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Maximum Credit Limit : |
USD 210000 |
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Status : |
Satisfactory |
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Payment Behaviour : |
Usually correct |
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Litigation : |
Clear |
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Comments : |
Subject is an established company having satisfactory
track. Business shows downward trends. Trade relations are fair. Payments are
usually correct and as per commitments. The company can be considered normal for business dealings
at usual trade terms and conditions. |
LOCATIONS
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Registered Office : |
No. 52/A, 1st Cross, 3rd Main, KIADB
Industrial Area, Hoskote, Bangalore – 562114, Karnataka, India |
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Tel. No.: |
91-80-25210668 / 7971660 |
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Fax No.: |
91-80-25097631 / 7971659 |
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E-Mail : |
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Website : |
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Head Office : |
#84, EPIP, Whitefield Industrial Area, Bangalore 560 066 |
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Tel. No.: |
91 80 67171100 |
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Fax No.: |
91 80 28413632 |
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E-Mail : |
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Branches : |
85 Great Oaks Boulevard, San Jose, CA 95119 |
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Tel. No.: |
(408) 360-9100 |
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Fax No.: |
(408) 360-9170 |
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E-Mail : |
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Overseas
Office : |
Allied
Data Technologies (ADT), Rotterdam Telecom IAD Engg.
& Sales Pascalweg 1, 3208 KL
Spijkenisse, The Netherlands |
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Tel. No.: |
+31 181 652525 |
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Fax No.: |
+31 181 614840 |
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E-Mail : |
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Website
: |
www.allieddata.nl (Dutch) www.allieddata.com (English) |
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Overseas
Office : |
Allied
Data Technologies (Thai) Company Limited, 85/7 Moo6. T. Samnaktorn, A.
Banchang, Rayong 21130, Thailand |
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Tel. No.: |
+ 66 (038) 963-523 |
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Fax No.: |
+66 (038) 963-526 |
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E-Mail : |
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Website
: |
DIRECTORS
|
Name : |
Ms. Kavita Soni |
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Designation : |
Director |
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Address : |
Post BoxNo. 50841, Dubai, UAE |
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Date of Birth/Age : |
13.07.1965 |
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Date of Appointment : |
13.12.1993 |
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Name : |
Mr. Ved Prakash Soni |
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Designation : |
Director |
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Address : |
Prestige Casa Blanca, No. 9, Airport Road, Bangalore –
560008, Karnataka, India |
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Date of Birth/Age : |
16.10.1932 |
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Date of Appointment : |
24.10.1998 |
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Name : |
Mr. Kiran Soni |
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Designation : |
Whole Time Director |
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Address : |
Prestige Casa Blanca, No. 9, Airport Road, Bangalore –
560008, Karnataka, India |
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Date of Birth/Age : |
24.10.1967 |
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Date of Appointment : |
02.09.2002 |
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Name : |
Mr. S Rama Kumar |
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Designation : |
Director |
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Address : |
No. 90, 2nd Main, KHB Colony, Gandhi Nagar
Extension, Yelahanka, Bangalore – 560064, Maharashtra, India |
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Date of Birth/Age : |
31.01.1963 |
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Date of Appointment : |
10.08.2005 |
MAJOR
SHAREHOLDERS / SHAREHOLDING PATTERN
AS ON 30.09.2005
|
``Names of Shareholders |
|
No.
of Shares |
|
Sanjay Soni |
|
1245220 |
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Kiran Soni |
|
60100 |
|
Kavitha Soni |
|
50100 |
|
Shashi Soni |
|
187280 |
|
Tej Soni |
|
100 |
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Dinanath Soni |
|
100 |
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V. P. Soni |
|
100 |
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IDBI |
|
725000 |
|
Vijay D Gupta |
|
211200 |
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Total
|
|
2479200 |
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Name
of Allottee |
Equity Shares |
Preference Shares |
|
IL and FS Trust Company Limited [As on 26.09.2006] |
5000 |
1999000 |
|
|
|
|
|
Bhattacharjee Holding LLC
[As on 10.08.2006] |
1239600 |
-- |
|
Kaushik Mehta [As
on 10.08.2006] |
450764 |
-- |
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Steve Tabaska [As
on 10.08.2006] |
150255 |
-- |
AS ON 30.09.2007
|
Equity
Share Breakup |
|
Percentage
of Holding |
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Category
|
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Foreign holdings [Foreign
institutional investors, Foreign Companies, Foreign Financial Institutions, Non-resident
Indian or Overseas corporate bodies or others] |
|
42.22 |
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Directors or relatives of directors |
|
52.03 |
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Other top fifty shareholders |
|
5.75 |
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Total
|
|
100.00 |
BUSINESS
DETAILS
|
Line of Business : |
Manufacturer and exporter of scientific equipments,
research instrument required in the field of electronics and vacuum
technology. |
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Exports : |
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Countries
: |
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GENERAL
INFORMATION
|
No. of Employees : |
500 |
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Bankers : |
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Banking
Relations : |
Satisfactory |
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Auditors : |
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Name
: |
Unnikrishnan Chartered Accountants |
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Address
: |
Jupiter – 1, 30:1, 4th Cross, 7th
Block, Jayanagar [West], Bangalore – 560070, Karnataka, India |
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Parent Company : |
Si2
Microsystems, Inc. / Silitronics, Inc., San Jose, CA |
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Address
: |
85, Great Oaks Blvd., San
Jose, CA 95119 |
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Tel.
No.: |
(408) 360-9100 |
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Fax
No.: |
(408) 360-9170 |
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E-Mail
: |
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Web: |
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Associates/Subsidiaries : |
Suntech Americas LLC |
CAPITAL
STRUCTURE
AS ON
30.09.2007
Authorised Capital :
|
No. of Shares |
Type |
Value |
Amount |
|
5921429 |
Equity Shares |
Rs. 10/- each |
Rs. 59.214 Millions |
|
2078571 |
Preference Shares |
Rs. 10/- each |
Rs. 20.786 Millions |
|
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Total
|
|
Rs.
80.000 Millions |
Issued, Subscribed & Paid-up Capital :
|
No. of Shares |
Type |
Value |
Amount |
|
4364104 |
Equity Shares |
Rs. 10/- each |
Rs.
43.641 Millions |
|
2077571 |
Preference Shares |
Rs. 10/- each |
Rs.
20.776 Millions |
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Total
|
|
Rs. 64.417 Millions |
AS ON 31.03.2007
Issued, Subscribed & Paid-up Capital :
|
No. of Shares |
Type |
Value |
Amount |
|
2479200 |
Equity Shares |
Rs. 10/- each |
Rs.
24.792 Millions |
FINANCIAL
DATA
[all figures are in Rupees Millions]
ABRIDGED
BALANCE SHEET
|
SOURCES OF FUNDS |
|
31.03.2007 |
31.03.2006 |
|
|
SHAREHOLDERS FUNDS |
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|
|
|
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1] Share Capital |
|
24.792 |
24.792 |
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2] Share Application Money |
|
0.000 |
0.000 |
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3] Reserves & Surplus |
|
17.763 |
8.614 |
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4] (Accumulated Losses) |
|
0.000 |
0.000 |
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NETWORTH |
|
42.555 |
33.406 |
|
|
LOAN FUNDS |
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|
|
|
|
1] Secured Loans |
|
53.862 |
0.000 |
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2] Unsecured Loans |
|
58.008 |
47.340 |
|
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TOTAL
BORROWING |
|
111.870 |
47.340 |
|
|
DEFERRED TAX LIABILITIES |
|
2.790 |
0.000 |
|
|
|
|
|
|
|
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TOTAL |
|
157.215 |
80.746 |
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|
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|
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APPLICATION OF FUNDS |
|
|
|
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|
|
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|
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|
FIXED ASSETS [Net Block] |
|
50.035 |
30.477 |
|
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Capital work-in-progress |
|
0.000 |
0.000 |
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|
|
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INVESTMENT |
|
58.735 |
31.555 |
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|
DEFERREX TAX ASSETS |
|
0.000 |
0.000 |
|
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CURRENT ASSETS, LOANS & ADVANCES |
|
|
|
|
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Inventories |
|
20.557 |
29.770 |
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Sundry Debtors |
|
82.802 |
81.707 |
|
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Cash & Bank Balances |
|
9.313 |
4.916 |
|
|
Other Current Assets |
|
0.000 |
0.000 |
|
|
Loans & Advances |
|
45.596 |
9.939 |
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Total Current Assets |
|
158.268 |
126.332 |
|
|
Less :
CURRENT LIABILITIES & PROVISIONS |
|
|
|
|
|
|
Current Liabilities |
|
107.623 |
107.618 |
|
|
Provisions |
|
2.200 |
0.000 |
|
Total Current Liabilities |
|
109.823 |
107.618 |
|
|
Net Current Assets |
|
48.445 |
18.714 |
|
|
|
|
|
|
|
|
MISCELLANEOUS EXPENSES |
|
0.000 |
0.000 |
|
|
|
|
|
|
|
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TOTAL |
|
157.215 |
80.746 |
|
PROFIT
& LOSS ACCOUNT
|
PARTICULARS |
|
31.03.2007 |
31.03.2006 |
|
|
Sales Turnover |
|
348.434 |
659.270 |
|
|
Other Income |
|
32.149 |
5.719 |
|
|
Total Income |
|
380.583 |
664.989 |
|
|
|
|
|
|
|
|
Profit/(Loss) Before Tax |
|
36.900 |
18.012 |
|
|
Provision for Taxation |
|
5.355 |
[31.004] |
|
|
Profit/(Loss) After Tax |
|
31.545 |
49.016 |
|
|
|
|
|
|
|
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Imports Value |
|
26.167 |
1.731 |
|
|
|
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|
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Expenditures : |
|
|
|
|
|
|
Depreciation & Amortization |
|
5.369 |
4.691 |
|
|
Other Expenditure |
|
338.314 |
642.286 |
|
Total Expenditure |
|
343.683 |
646.977 |
|
KEY
RATIOS
|
PARTICULARS |
|
|
31.03.2007 |
31.03.2006 |
|
PAT / Total Income |
(%) |
|
8.29 |
7.37 |
|
|
|
|
|
|
|
Net Profit Margin (PBT/Sales) |
(%) |
|
10.59 |
2.73 |
|
|
|
|
|
|
|
Return on Total Assets (PBT/Total Assets} |
(%) |
|
17.71 |
11.49 |
|
|
|
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|
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|
Return on Investment (ROI) (PBT/Networth) |
|
|
0.87 |
0.54 |
|
|
|
|
|
|
|
Debt Equity Ratio (Total Liability/Networth) |
|
|
5.21 |
4.64 |
|
|
|
|
|
|
|
Current Ratio (Current Asset/Current
Liability) |
|
|
1.44 |
1.17 |
LOCAL
AGENCY FURTHER INFORMATION
Note :
Sun Electronics Technologies Limited which is originally
incorporated on 08.12.1993, the name of the said company is this day changed to
Si2 Microsystems Limited w.e.f. 18.06.2007
Bankers Charges Report as per Registry
|
Name of the company |
SUN ELECTRONICS TECHNOLOGIES LIMITED |
||||||||||||
|
Presented By |
Bank of Baroda, Opera House
Branch, Mumbai – 400004 |
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|
1) Date and description of
instrument creating the change |
31st
January 2006, Composite
Hypothecation Agreement |
||||||||||||
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2) Amount secured by the charge/amount
owing on the securities of charge |
Rs.
80.000 Millions |
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|
3) Short particular of the
property charged. If the property acquired is subject to charge, date of the
acquired of the property should be given |
Stock
Book Debts and Machineries |
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4) Gist of the terms and
conditions and extent and operation of the charge. |
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5) Name and Address and
description of the person entitled to the charge. |
Bank
of Baroda, Kantilal House, 14, Mama Parmanand Marg, Mumbai – 400004 |
||||||||||||
|
6) Date and brief description of instrument
modifying the charge |
NA |
||||||||||||
|
7) Particulars of modifications
specifying the terms and conditions or the extent of operations of the charge
in which modification is made and the details of the modification. |
NA |
|
This
form is for |
Creation
of charge |
|
Corporate
identity number of the company |
U85110KA1993PLC015018 |
|
Name
of the company |
SI2 MICROSYSTEMS LIMITED |
|
Address
of the registered office or of the principal place of business in India of the company |
No. 52/A, 1st Cross, 3rd Main, KIADB
Industrial Area, Hoskote, Bangalore – 562114, Karnataka, India |
|
Type
of charge |
|
|
Particular
of charge holder |
State
Bank of Mysore Bangalore
Branch C and I Division Avenue
Road, Bangalore - 560009, Karnataka,
India |
|
Nature
of description of the instrument creating or modifying the charge |
Agreement
of hypothecation of goods and assets |
|
Date of
instrument Creating the charge |
28.08.2007 |
|
Amount
secured by the charge |
Rs.
92.500 Millions |
|
Brief
particulars of the principal terms an conditions and extent and operation of
the charge |
Rate
of Interest Letter
of Credit : As per extent Instructions or as per RBI guidelines issued in
this behalf from time to time Bank
of Guarantee – Letter of Credit : As per extent Instructions or as per RBI
guidelines issued in this behalf from time to time Term
Loan – SBMTL – 3 interest at 13.25 % p.a. for the Term Loan Terms
of Repayment Letter
of credit – Usance Period 90 days [ILC And 180 days [FLC Bank
Guarantee : Maximum Period 12 Months to 36 months Term
Loan Repayable in 5/12 years with a moratorium period of 6 months i.e.
repayable in 59 monthly installments of Rs. 1.210 Millions and final
instllment of Rs. 1.110 Millions First
of such installment will commence from January 2008 Margin
Letter
of Credit 25 % Bank
guarantee 10 % Term
loan 48 % Extent
and Operation of the charge The
charge extends on all the hypothecated assets The
charges will operate as a continuing security till the repayment of the loan
together all interest, costs, charges, expenses and all other monies payable
by the company Others
the
company has undertaken to keep the hypothecated assets in good and marketable
conditions at its expenses. |
|
Short
particulars of the property charged |
The
Pari Passu charge over assets of the coampny stored or ly8ing at the premises
in Plot No. 84, KIADB, Whitefield, Bangalore and Equitable Mortgage of
Factory land and building situated at No. 52/A, 1st Cross, 3rd
Main, KIADB Industrial Area, Hoskote – 562114, Bangalore Rural District,
along with Bank of Baroda, Opera House Branch, Mumbai |
AS PER WEBSITE
Profile
Si2 Microsystems (Si2) delivers turnkey systems and
System-in-Package (SiP) solutions by integrating System & Chip design
capabilities with Manufacturing Technology.
Si2 was formed in 2006 by rolling up three organizations, which have been in
business each for over 15 years. Silitronics, Inc. of San Jose, CA, a premier
custom microelectronics manufacturing company with expertise in RF, CSP, and
SiP Packaging Technology, Sun Electronic Technologies of Bangalore, India, a
world-class manufacturing company with globally qualified SMT lines and D’gipro
Systems also of Bangalore, India, with domain expertise in ASIC, PCB and
sub-system design.
Si2 has three business divisions; ASiP - customer and application specific SiP
solutions, FSiP – Standard and semi-custom SiP solutions for wireless
applications, & ODM – turnkey system and sub-system manufacturing business
with design expertise in the area of telecommunication systems like IAD, and
SDRAM Memory Modules for PC and other appliances. Their solutions support a
global customer base requiring commercial, military and space applications.
Over 200 employees globally support their SiP and system manufacturing
facilities and design centers at San Jose, CA and Bangalore, India.
By leveraging SiP, ASIC, System Engineering capabilities and in-house
manufacturing, they provide co-designed solutions optimized for form-factor
(size), performance, price and time-to-market. Their core design expertise and
IP is in the area of developing communication systems, integrated multi-service
radio and antenna micro-systems and critical areas of SiP manufacturing
technology.
Management
Team
Arya Bhattacherjee is the Chairman of the Board
and CEO. Earlier, he was the founder and CEO of Arcus Technology, a fabless
semiconductor company designing telecom and mixed signal ASIC and sub-system
solutions. Arcus was acquired by Cypress and it’s spin-off Armedia was acquired
by Broadcom. Over the years, he enabled several successful Silicon Valley
start-ups. He was featured in the Wall Street Journal, PBS show “Emerging
Powers”, EDN and several other media for pioneering IC design technology in
India. He started his career with Intel followed by Cypress and holds several
patents and publications. He has a B.Tech from IIT, BHU in India and an MS from
the University of Illinois, Urbana. Arya has also provided consulting services
for NASA and Sandia Labs. He is the recipient of President of India’s Gold Medal
in 2003.
Dinanath Soni is the member of the board and Executive
Director of Si2, India. He has over 25 years of experience setting up and
establishing successful enterprises. He is the co-founder of SunTech and Logix Microsystems,
which currently is listed among the top 500 companies in India. Dinanath
started his career with Wipro and has an Engineering Degree in Electronics and
Communications from Bangalore University.
Sanjay Soni is the member of the board and President of Si2
India. He is also the Co-Founder of SunTech and Logix Microsystems. A Commerce
Honors graduate from The Sydenham College, Mumbai, India, Sanjay also holds a
MBA degree from the Indian Institute of Management, Bangalore (IIMB). He has
written several books on computer science and received an award from the late
Indian Prime Minister Rajiv Gandhi in the early 1990’s for his work towards
increasing computer education in India.
Kaushik Mehta is the Executive VP of SiP Manufacturing. He is
also the founder and the President of Silitronics. He has received recognitions
from various organizations and blue-chip customers for his innovations in SiP
packaging technology. He received his Bachelor of Science in Electrical
Engineering from Bombay University, India. Kaushik has special qualifications
in designing and packaging military components for US Defense organizations.
Steve Tabaska is the Executive VP and the General Manager of
ODM business. He has over 25 years of engineering, product development and
program management experience in the telecommunications industry. Earlier, he
was the VP Engineering for Xros (acquired by Nortel). Prior to this, he served
at MCI, Nortel and Digital Link. Steve has a BSEE from Milwaukee School of
Engineering and an MBA from the University of Houston.
V.K. Vasudevan is the VP of Engineering for Si2, India. He has
over to 20 years experience in the Telecom/Datacom industry space. His area of
experience spreads from large telecom switch system design at CDOT to large multi-million
gate telecom SOC design at Arcus Technology and Cypress Semiconductor. He has
delivered innovative solutions in the area of power supply, telecom ASIC and
systems like high bandwidth SONET/SDH transport solution. He has an Engineering
degree from REC, Trichy.
Tat Huen is the VP of Technology Development. He is heading
the Functional System-in-Package (FSiP) product development and the RF &
Antenna development activities. He has more than 25 years of engineering and
product development experience in the communications industry. He previously
served as President of PULSARadio, a startup company that developed fixed
broadband wireless equipment (pre-WiMAX). He held senior management positions
at Ishoni Networks, California Microwave, Netro, and various management and
engineering positions at M/A-Com, & Bell Labs. Tat invented Wireless Fast
Ethernet at WinNet, a company that he founded, and served as the VP of
Engineering and CTO. WinNet was sold to Alvarion, which is now the largest
supplier of WiMAX equipment. He received a BSEE from The Cooper Union, NY and a
Master of Engineering from RPI, Troy, NY.
S. Ramachandran is the VP of Business Development for Si2,
India. He is the founder of D’gipro and continues to drive business management
and growth strategy. He has over 30 years of experience in various areas of
VLSI design business. He started his career in avionics and control guidance at
ISRO (Indian Space Research Organization). He has an Engineering degree from
Bangalore University.
Ken Neighbors is the VP of Global Marketing and Sales.
Earlier, he founded SylKen Marketing International (SMI), which was established
to provide an innovative collaborative approach to telecom marketing
consultancy. He has over thirty years of experience in telecom products and
services. He held senior marketing positions with leading companies such as
Onepath Networks, Marconi, ADC, and Acme Cleveland. Ken majored in Business
Administration from Indiana University.
Sarma GH is the drive behind the entire manufacturing
technology and quality. For over 30 years, he has been in the forefront of
microelectronic technologies in India and has spearheaded many national level
programmes and projects, including establishment of first sub-micron VLSI fab
at ITI, Bangalore. His technical expertise encompasses most of the electronic
manufacturing domains like SMT, thick film, thin film, VLSI process, VLSI
assembly and packaging, SAW devices, opto-modules, MEMs etc. He is equally
active in related research and academic fields with many publications. He is a
post graduate from IIT Bombay.
Satbir Madra is the Vice President of Packaging Technology and
Development of Silitronics, Inc. He has extensive experience in the area of
compound semiconductor manufacturing, high volume advanced packaging and solid
state physics applications. He has held senior management and research
scientist positions with Watkins Johnson Company and WJ Communications,
including development of High-Density Plasma CVD Reactors for low-k intermetal
dielectric films. He received his bachelor and graduate degrees in mechanical
engineering with a special focus on VLSI fabrication. Satbir frequently teaches
courses on CVD and device packaging. He is an invited speaker at JEDEC, IMAPS
and IEEE-CPMT consortia and has presented more than one dozen research
publications on advanced device modeling of GaInP/GaAs HBT?s and carrier
transport at several premier technical conferences around the world. He also
has liaison with technology incubators at academia and research labs. Satbir is
listed in the Marquis Who?s Who in America for 2006 and 2007. Satbir is a
honorary member of Pi Tau Sigma and began his career by teaching at San Jose
State University, California.
Application
Specific System in a Package
Business Model
ASiPs are delivered as turnkey solutions – starting from
Architectural Concept to Design to Prototyping, Qualification & Final
Production. All turnkey solutions are application specific and customer driven.
They undertake complete architectural responsibility for co-designing the
solution leveraging their ASIC, System Design and SiP Technology strengths to
optimize customer needs
They engage customers at critical milestone sign-offs to ensure minimal design
changes and also to ensure first time success. Their commercial package would
include both development and production costs. They will work with customers
and create an attractive commercial package optimized for the required
form-factor, performance at the least possible investment for a mutually
beneficial business relationship.
Technology
Substrate Engineering – This involves selection of appropriate substrates like
FR-4, BT, Alumina, Ceramic, IMC, DBC, etc. depending on the technology and cost
requirements of the final solution. They have in house technology and library
for embedding passives, varieties of filters, etc. primarily for RF designs.
However, they outsource the LTCC manufacturing to vendors like Kyocera, Anaren,
etc.
ASIC & FPGA design is done using traditional methods and are mostly
digital. The primary objective is to meet customers’ integration, cost, and
time to market needs. SiP technology allows freedom from long drawn ASIC design
cycles. The combined methodology of using ASIC design and standard components
through value added system engineering provides the most optimal solution.
Tools – Their design team has a thorough knowledge of the complete design
methodology of SiP implementation and has the required amount of exposure with
the whole range of software tools. For ASIC design, they follow the standard
Cadence, Synopsys or Magma tool flow. For PCB design, SI/EM analysis, they use
Cadence’s Allegro and Sigrity’s SpeedXP respectively. For Package layout, they
use Sigrity’s UPD and for RF design and SI/EM analysis, they use AWR and
Sigrity’s SpeedXP respectively. For thermal analysis, they have expertise in
using Optimal, Icepack tool sets. Their hardware lab is equipped for advanced
antenna and RF microsystem design.
Si2 has built streamlined project management teams with risk mitigation,
exceptional design capabilities, strong vendor development skills, etc.
1. Design Methodology:
Si2 follows the Industry Standard design methodology for
successful delivery of critical programs to customers. The reliability is
“designed in” by using FEM techniques at chip level, package level, and process
level.
2. Design Team:
Si2 has established design teams with over a decade of
experience in Defense, Aerospace & Medical Electronics, who are well versed
with the industry standard tools and related processes.
a) System Design – Multi technologies: Mixed Signal, Analog & Digital
b) VLSI & ASIC design
c) Thermal, Cross Talk, Signal Integrity & Reliability
design
d) MIL / Aerospace Standards
e) SiP implementation & Advanced Packaging design
f) RF & Antenna design
3. Packaging:
Si2 has in-house advanced package design capability. They
use Ceramic and Plastic Packaging Technologies & Pre-molded technologies
including PGA, LCC, BGA, CSP, LTCC, PBGA, Stacked Die, QFN, SDIO, USB, etc.
4. Testing:
Si2 places a lot of emphasis on first time success of its
solutions with very high first pass yield output. Extensive simulation is
carried out during the design process before design actualization of the
intended solution. The quest for perfection in the design stage is complemented
by extensive test facility in the Si2 production floor for the products coming
out of the manufacturing line that has been aligned with the rest of the
process to yield products that pass 100% of the test vectors.
Si2’s testing philosophy encompasses functional, parametric and post assembly
Go/No-Go inspections. Functional testing is done with the help of custom test
benches depending on the product to be tested. For parametric testing, industry
standard test sets are employed and for post assembly inspection, advanced
optical, X-ray technology based instruments are used apart from the standard
techniques like Bed of Nails, ICT (In-Circuit Testing), etc. The testing
methodology employed at Si2 is capable of handling JTAG based testing.
Si2 has relationships with third-party houses for functional test, MIL and
Rad-hard qualification.
Manufacturing Infrastructure
Si2 has a captive state-of-the-art fully automated chip
level assembly line which includes precision and highly flexible die bonders to
handle wide variety of base structures (ceramic, laminate or lead frame), fast
and precision wire bonders with full flexibility to handle the special needs of
stacked die approach (Au, Al and Cu wires/ribbons), flip chip handling options,
ball-attach and micro-BGA assembly line, molding and hermetic packaging line,
etc. The process parameters in the manufacturing line are evolved carefully
through continuous line and process qualification procedures and these data
form the strict guidelines at the design stage.
They offer exciting careers at Si2 for those who thrive on
challenges, in the area of advanced semiconductor packaging technology. As an
integrated packaging solutions provider to the fast paced semiconductor
industry, people are Si2’s main resource in providing innovative packaging
solutions that transform their customers’ solutions into marketable and
commercially successful products at the shortest possible time.
Employees drive the success of Si2 by consistently putting
their company's values into action. Si2 emphasizes customer centricity,
excellence, accountability, teamwork, integrity and dedication to achieve
company objectives. Creativity is the cornerstone of success at Si2 and they
believe creativity extends beyond technology; they try to be innovative in all
they do.
Si2 offers career opportunities in Engineering,
Manufacturing, Business Development and Administration at the India Development
Center.
They intend to fill positions for the following skill sets:
1) SiP design
2) Package design
3) Thermal / Mechanical design
4) System Architecture for ASIC design
5) Telco H/W engineer with IAD design experience
6) S/W engineer with exposure to VOIP protocol;
7) RF design;
8) Antenna design
9) Process engineering for CSP / Advanced Packaging
10) HR Manager
11) SIP Layout Design
12) Signal Integrity- IC Packaging
13) Testing-Telecom Hardware
14) DFM/DFT-Telecom
15) AWR Engineer
16) Project Lead- ASIC Design
17) Design Engineer- ASIC Design
18) QA/QC Engineer
19) TL Validation-IP(FPGA);
20) PM with IAD Experience
CMT
REPORT (Corruption, Money Laundering & Terrorism]
The Public Notice information has been collected from
various sources including but not limited to: The Courts, India Prisons
Service, Interpol, etc.
1] INFORMATION
ON DESIGNATED PARTY
No records exist designating subject or any of its
beneficial owners, controlling shareholders or senior officers as terrorist or
terrorist organization or whom notice had been received that all financial
transactions involving their assets have been blocked or convicted, found
guilty or against whom a judgement or order had been entered in a proceedings
for violating money-laundering, anti-corruption or bribery or international
economic or anti-terrorism sanction laws or whose assets were seized, blocked,
frozen or ordered forfeited for violation of money laundering or international
anti-terrorism laws.
2] Court
Declaration :
No records exist to suggest that
subject is or was the subject of any formal or informal allegations,
prosecutions or other official proceeding for making any prohibited payments or
other improper payments to government officials for engaging in prohibited
transactions or with designated parties.
3] Asset
Declaration :
No records exist to suggest that the property or assets of
the subject are derived from criminal conduct or a prohibited transaction.
4] Record
on Financial Crime :
Charges or
conviction registered against subject: None
5] Records
on Violation of Anti-Corruption Laws :
Charges or
investigation registered against subject: None
6] Records
on Int’l Anti-Money Laundering Laws/Standards :
Charges or
investigation registered against subject: None
7] Criminal
Records
No
available information exist that suggest that subject or any of its principals
have been formally charged or convicted by a competent governmental authority
for any financial crime or under any formal investigation by a competent
government authority for any violation of anti-corruption laws or international
anti-money laundering laws or standard.
8] Affiliation
with Government :
No
record exists to suggest that any director or indirect owners, controlling
shareholders, director, officer or employee of the company is a government
official or a family member or close business associate of a Government
official.
9] Compensation
Package :
Our
market survey revealed that the amount of compensation sought by the subject is
fair and reasonable and comparable to compensation paid to others for similar
services.
10] Press Report
:
No press reports / filings exists on
the subject.
CORPORATE
GOVERNANCE
MIRA INFORM as part of its Due Diligence do provide comments
on Corporate Governance to identify management and governance. These factors
often have been predictive and in some cases have created vulnerabilities to
credit deterioration.
Our Governance Assessment focuses principally on the
interactions between a company’s management, its Board of Directors,
Shareholders and other financial stakeholders.
CONTRAVENTION
Subject is not known to have contravened any existing local
laws, regulations or policies that prohibit, restrict or otherwise affect the
terms and conditions that could be included in the agreement with the subject.
FOREIGN
EXCHANGE RATES
|
Currency |
Unit
|
Indian
Rupees |
|
US Dollar |
1 |
Rs.42.00 |
|
UK Pound |
1 |
Rs.82.14 |
|
Euro |
1 |
Rs.65.09 |
SCORE
& RATING EXPLANATIONS
|
SCORE
FACTORS |
RANGE |
POINTS |
|
HISTORY |
1~10 |
6 |
|
PAID-UP CAPITAL |
1~10 |
6 |
|
OPERATING SCALE |
1~10 |
5 |
|
FINANCIAL CONDITION |
|
|
|
--BUSINESS SCALE |
1~10 |
4 |
|
--PROFITABILIRY |
1~10 |
4 |
|
--LIQUIDITY |
1~10 |
5 |
|
--LEVERAGE |
1~10 |
5 |
|
--RESERVES |
1~10 |
5 |
|
--CREDIT LINES |
1~10 |
5 |
|
--MARGINS |
-5~5 |
- |
|
DEMERIT POINTS |
|
|
|
--BANK CHARGES |
YES/NO |
YES |
|
--LITIGATION |
YES/NO |
NO |
|
--OTHER ADVERSE INFORMATION |
YES/NO |
NO |
|
MERIT POINTS |
|
|
|
--SOLE DISTRIBUTORSHIP |
YES/NO |
NO |
|
--EXPORT ACTIVITIES |
YES/NO |
YES |
|
--AFFILIATION |
YES/NO |
YES |
|
--LISTED |
YES/NO |
NO |
|
--OTHER MERIT FACTORS |
YES/NO |
YES |
|
TOTAL |
|
45 |
This score serves as a reference to assess SC’s credit
risk and to set the amount of credit to be extended. It is calculated from a
composite of weighted scores obtained from each of the major sections of this
report. The assessed factors and their relative weights (as indicated through
%) are as follows:
Financial
condition (40%) Ownership
background (20%) Payment
record (10%)
Credit
history (10%) Market
trend (10%) Operational
size (10%)
RATING
EXPLANATIONS
|
RATING |
STATUS |
PROPOSED CREDIT LINE |
|
|
>86 |
Aaa |
Possesses an extremely sound financial base with the
strongest capability for timely payment of interest and principal sums |
Unlimited |
|
71-85 |
Aa |
Possesses adequate working capital. No caution needed for credit
transaction. It has above average (strong) capability for payment of interest
and principal sums |
Large |
|
56-70 |
A |
Financial & operational base are regarded healthy.
General unfavourable factors will not cause fatal effect. Satisfactory capability
for payment of interest and principal sums |
Fairly
Large |
|
41-55 |
Ba |
Overall operation is considered normal. Capable to meet
normal commitments. |
Satisfactory |
|
26-40 |
B |
Unfavourable & favourable factors carry similar weight
in credit consideration. Capability to overcome financial difficulties seems
comparatively below average. |
Small |
|
11-25 |
Ca |
Adverse factors are apparent. Repayment of interest and
principal sums in default or expected to be in default upon maturity |
Limited
with full security |
|
<10 |
C |
Absolute credit risk exists. Caution needed to be
exercised |
Credit
not recommended |
|
NR |
In view of the lack of information, we have no basis upon
which to recommend credit dealings |
No
Rating |
|