|
Report Date : |
29.11.2013 |
IDENTIFICATION DETAILS
|
Name : |
AXCELIS TECHNOLOGIES INC |
|
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|
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Registered Office : |
108 Cherry Hill
Drive, Beverly, MA 01915-1053 |
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Country : |
United States |
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|
|
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Financials (as on) : |
31.12.2012 |
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Date of Incorporation : |
21.12.1995 |
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Legal Form : |
Public Parent
Company |
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Line of Business : |
· designing, manufacturing and servicing ion implantation, dry strip and other processing equipment used in the fabrication of semiconductor chips. Manufacturer of Ion Implantation, Dry Strip, Thermal Processing &
Curing Equipment Used in the Production of Semiconductor Chips |
|
|
|
|
No. of Employees : |
879 |
RATING & COMMENTS
|
MIRA’s Rating : |
B |
|
RATING |
STATUS |
PROPOSED CREDIT LINE |
|
|
26-40 |
B |
Capability to overcome financial difficulties seems comparatively
below average. |
Small |
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Status : |
Moderate |
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Payment Behaviour : |
Slow but Correct |
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Litigation : |
Clear |
NOTES :
Any query related to this report can be made
on e-mail: infodept@mirainform.com
while quoting report number, name and date.
ECGC Country Risk Classification List – September 30th, 2013
|
Country Name |
Previous Rating (30.06.2013) |
Current Rating (30.09.2013) |
|
United
States |
A1 |
A1 |
|
Risk Category |
ECGC
Classification |
|
Insignificant |
A1 |
|
Low |
A2 |
|
Moderate |
B1 |
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High |
B2 |
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Very High |
C1 |
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Restricted |
C2 |
|
Off-credit |
D |
united StaTes ECONOMIC OVERVIEW
The US has the largest and most technologically
powerful economy in the world, with a per capita GDP of $49,800. In this
market-oriented economy, private individuals and business firms make most of
the decisions, and the federal and state governments buy needed goods and
services predominantly in the private marketplace. US business firms enjoy
greater flexibility than their counterparts in Western Europe and Japan in
decisions to expand capital plant, to lay off surplus workers, and to develop
new products. At the same time, they face higher barriers to enter their
rivals' home markets than foreign firms face entering US markets. US firms are
at or near the forefront in technological advances, especially in computers and
in medical, aerospace, and military equipment; their advantage has narrowed
since the end of World War II. The onrush of technology largely explains the
gradual development of a "two-tier labor market" in which those at
the bottom lack the education and the professional/technical skills of those at
the top and, more and more, fail to get comparable pay raises, health insurance
coverage, and other benefits. Since 1975, practically all the gains in
household income have gone to the top 20% of households. Since 1996, dividends
and capital gains have grown faster than wages or any other category of
after-tax income. Imported oil accounts for nearly 55% of US consumption. Crude
oil prices doubled between 2001 and 2006, the year home prices peaked; higher
gasoline prices ate into consumers' budgets and many individuals fell behind in
their mortgage payments. Oil prices climbed another 50% between 2006 and 2008,
and bank foreclosures more than doubled in the same period. Besides dampening
the housing market, soaring oil prices caused a drop in the value of the dollar
and a deterioration in the US merchandise trade deficit, which peaked at $840
billion in 2008. The sub-prime mortgage crisis, falling home prices, investment
bank failures, tight credit, and the global economic downturn pushed the United
States into a recession by mid-2008. GDP contracted until the third quarter of
2009, making this the deepest and longest downturn since the Great Depression.
To help stabilize financial markets, in October 2008 the US Congress
established a $700 billion Troubled Asset Relief Program (TARP). The government
used some of these funds to purchase equity in US banks and industrial
corporations, much of which had been returned to the government by early 2011.
In January 2009 the US Congress passed and President Barack OBAMA signed a bill
providing an additional $787 billion fiscal stimulus to be used over 10 years -
two-thirds on additional spending and one-third on tax cuts - to create jobs
and to help the economy recover. In 2010 and 2011, the federal budget deficit
reached nearly 9% of GDP. In 2012 the federal government reduced the growth of
spending and the deficit shrank to 7.6% of GDP. Wars in Iraq and Afghanistan
required major shifts in national resources from civilian to military purposes
and contributed to the growth of the budget deficit and public debt. Through
2011, the direct costs of the wars totaled nearly $900 billion, according to US
government figures. US revenues from taxes and other sources are lower, as a
percentage of GDP, than those of most other countries. In March 2010, President
OBAMA signed into law the Patient Protection and Affordable Care Act, a health
insurance reform that will extend coverage to an additional 32 million American
citizens by 2016, through private health insurance for the general population
and Medicaid for the impoverished. Total spending on health care - public plus
private - rose from 9.0% of GDP in 1980 to 17.9% in 2010. In July 2010, the
president signed the DODD-FRANK Wall Street Reform and Consumer Protection Act,
a law designed to promote financial stability by protecting consumers from
financial abuses, ending taxpayer bailouts of financial firms, dealing with
troubled banks that are "too big to fail," and improving
accountability and transparency in the financial system - in particular, by
requiring certain financial derivatives to be traded in markets that are
subject to government regulation and oversight. In December 2012, the Federal
Reserve Board announced plans to purchase $85 billion per month of
mortgage-backed and Treasury securities in an effort to hold down long-term
interest rates, and to keep short term rates near zero until unemployment drops
to 6.5% from the December rate of 7.8%, or until inflation rises above 2.5%.
Long-term problems include stagnation of wages for lower-income families,
inadequate investment in deteriorating infrastructure, rapidly rising medical
and pension costs of an aging population, energy shortages, and sizable current
account and budget deficits - including significant budget shortages for state
governments.
|
Source : CIA |
Axcelis Technologies Inc
108 Cherry Hill
Drive
Beverly, MA
01915-1053
United States
Tel: 978-787-4000
Fax: 978-787-3000
Web: www.axcelis.com
Employees: 879
Company Type: Public
Parent
Corporate Family: 23 Companies
Traded: NASDAQ: ACLS
Incorporation
Date: 21-Dec-1995
Auditor: Ernst
& Young LLP
Financials in: USD (Millions)
Fiscal Year End: 31-Dec-2012
Reporting
Currency: US Dollar
Annual Sales:
203.4 1
Net Income:
(34.0)
Total Assets:
222.2 2
Market Value:
258.0 (08-Nov-2013)
Axcelis Technologies, Inc. (Axcelis) designs,
manufactures and services ion implantation, dry strip and other processing
equipment used in the fabrication of semiconductor chips. The Company sells to
semiconductor chip manufacturers worldwide. The ion implantation business
comprised approximately 76.7% of its revenue during the year ended December 31,
2012, with the remaining 23.3% of revenue derived from its dry strip and other
processing systems. In addition to equipment, the Company provides aftermarket
service and support, including spare parts, equipment upgrades, maintenance
services and customer training. In December 2012, the Company sold to Lam
Research Corporation (Lam) the intellectual property rights and other assets
relating to its dry strip systems product line. For the nine months ended 30
September 2013, Axcelis Technologies Inc revenues decreased 14% to $137.1M. Net
loss decreased 8% to $17.8M. Revenues reflect Product decrease of 13% to
$118.2M, Service decrease of 17% to $18.9M. Lower net loss reflects Research
and development decrease of 19% to $25.9M (expense), Sales and marketing
decrease of 12% to $16.1M (expense), General and administrative decrease of 7%
to $19.2M (expense).
Industry
Industry
Machinery and Equipment Manufacturing
ANZSIC 2006: 2469 - Other Specialised Machinery and
Equipment Manufacturing
ISIC Rev 4:
2819 - Manufacture of other general-purpose machinery
NACE Rev 2:
2829 - Manufacture of other general-purpose machinery n.e.c.
NAICS 2012:
334413 - Semiconductor and Related Device Manufacturing
UK SIC 2007:
2829 - Manufacture of other general-purpose machinery n.e.c.
US SIC 1987:
3559 - Special Industry Machinery, Not Elsewhere Classified
(Emails Available)
|
Name |
Title |
|
Mary G. Puma |
Chairman of the Board, President, Chief Executive Officer |
|
Kevin J. Brewer |
Chief Financial Officer |
|
Lynnette C. Fallon |
Executive Vice President - Human Resources/Legal, General Counsel,
Corporate Secretary |
|
John E. Aldeborgh |
Executive Vice President - Customer Operations |
|
William J. Bintz |
Executive Vice President - Product Development, Engineering and
Marketing |
|
|
1 - Profit &
Loss Item Exchange Rate: USD 1 = USD 1
2 - Balance Sheet
Item Exchange Rate: USD 1 = USD 1
Location
108 Cherry Hill
Drive
Beverly, MA, 01915-1053
Essex County
United States
Tel: 978-787-4000
Fax: 978-787-3000
Web: www.axcelis.com
Quote Symbol -
Exchange
ACLS - NASDAQ
Sales USD(mil): 203.4
Assets USD(mil): 222.2
Employees: 879
Fiscal Year End: 31-Dec-2012
Industry: Miscellaneous Capital
Goods
Incorporation Date: 21-Dec-1995
Company Type: Public
Parent
Quoted Status: Quoted
Chairman of the Board, President, Chief Executive Officer:
Mary G. Puma
Industry Codes
ANZSIC 2006
Codes:
2469 - Other
Specialised Machinery and Equipment Manufacturing
2429 - Other
Electronic Equipment Manufacturing
2419 - Other
Professional and Scientific Equipment Manufacturing
ISIC Rev 4 Codes:
2819 - Manufacture
of other general-purpose machinery
2610 - Manufacture
of electronic components and boards
2651 - Manufacture
of measuring, testing, navigating and control equipment
NACE Rev 2 Codes:
2829 - Manufacture
of other general-purpose machinery n.e.c.
2611 - Manufacture
of electronic components
2651 - Manufacture
of instruments and appliances for measuring, testing and navigation
NAICS 2012 Codes:
334413 - Semiconductor
and Related Device Manufacturing
334515 - Instrument
Manufacturing for Measuring and Testing Electricity and Electrical Signals
US SIC 1987:
3559 - Special
Industry Machinery, Not Elsewhere Classified
3825 - Instruments
for Measuring and Testing of Electricity and Electrical Signals
3674 - Semiconductors
and Related Devices
UK SIC 2007:
2829 - Manufacture
of other general-purpose machinery n.e.c.
2611 - Manufacture
of electronic components
2651 - Manufacture of instruments and
appliances for measuring, testing and navigation
Business Description
Axcelis
Technologies, Inc. (Axcelis), incorporated on December 21, 1995, designs, manufactures
and services ion implantation, dry strip and other processing equipment used in
the fabrication of semiconductor chips. The Company sells to semiconductor chip
manufacturers worldwide. The ion implantation business comprised approximately
76.7% of its revenue during the year ended December 31, 2012, with the
remaining 23.3% of revenue derived from its dry strip and other processing
systems. In addition to equipment, the Company provides aftermarket service and
support, including spare parts, equipment upgrades, maintenance services and
customer training. In December 2012, the Company sold to Lam Research
Corporation (Lam) the intellectual property rights and other assets relating to
its dry strip systems product line.
Ion Implantation Systems
Ion implantation
is a principal step in the transistor formation cycle of the semiconductor
manufacturing process. An ion implanter is a large, technically advanced system
that injects dopants such as arsenic, boron or phosphorus into a silicon wafer.
These dopants are ionized and therefore have electric charges. With an electric
charge they can be manipulated, moved and accelerated with electric and
magnetic fields.
Axcelis offers a line of high-energy, high-current
and medium-current implanters for all application requirements. The Optima XEx
combines Axcelis' production RF Linac high energy, spot beam technology with a
high-speed, single wafer end station, enabling unmatched throughput. Axcelis'
advanced spot beam ensures that all points across the wafer see the same beam
at the same beam angle. Axcelis’s single wafer product for high current
applications is the Optima HDx. In 2012, Axcelis shipped its Purion M medium
current ion implant system. Axcelis has recently not had a competitive offering
in this market space.
Dry Strip
The Company’s
dry strip machines, also called ashers, use microwave and radio frequency
energy to turn process gases into plasma, which then acts to clean the surface
of the wafer by removing the photoresist and unwanted residue. Axcelis has
offered a full line of dry strip tools that cover the entire range of customer
applications
Aftermarket Support and Services
The Company
offers its customers aftermarket service and support throughout the lifecycle
of the equipment it manufactures, as well as equipment the Company previously
manufactured. The service and support that the Company provides include spare
parts, equipment upgrades, and maintenance services. The Company provides
varying levels of sales, service and applications support out of its field
offices to customers located in 32 countries. Revenue generated through its
service and support business represented about 61.0%, of revenue in 2012. In
2012, Ulvac Techno, a Japanese company, began providing aftermarket services
and support services for its products in Japan.
The Company
competes with Applied Materials, Inc., SEN, Nissin Electric Co., Ltd. and
Advanced Ion Beam Technology, Inc.
More Business Descriptions
Axcelis
Technologies, Inc. (Axcelis) designs, manufactures and services ion
implantation, dry strip and other processing equipment used in the fabrication
of semiconductor chips. The Company sells to semiconductor chip manufacturers
worldwide. The ion implantation business comprised approximately 76.7% of its
revenue during the year ended December 31, 2012, with the remaining 23.3% of
revenue derived from its dry strip and other processing systems. In addition to
equipment, the Company provides aftermarket service and support, including
spare parts, equipment upgrades, maintenance services and customer training. In
December 2012, the Company sold to Lam Research Corporation (Lam) the
intellectual property rights and other assets relating to its dry strip systems
product line. For the nine months ended 30 September 2013, Axcelis Technologies
Inc revenues decreased 14% to $137.1M. Net loss decreased 8% to $17.8M.
Revenues reflect Product decrease of 13% to $118.2M, Service decrease of 17% to
$18.9M. Lower net loss reflects Research and development decrease of 19% to
$25.9M (expense), Sales and marketing decrease of 12% to $16.1M (expense),
General and administrative decrease of 7% to $19.2M (expense).
Ion Implantation, Dry Strip, Thermal Processing
& Curing Equipment Used in the Production of Semiconductor Chips Mfr
Establishments
primarily engaged in manufacturing special industry machinery, not elsewhere
classified, such as smelting and refining equipment, cement making,
clayworking, cotton ginning, glass making, hat making, incandescent lamp
making, leather working, paint making, rubber working, cigar and cigarette
making, tobacco working, shoe making, and stone working machinery, and
industrial sewing machines, and automotive maintenance machinery and equipment.
Axcelis
Technologies, Inc. (Axcelis) designs, manufactures and services ion
implementation, dry strips and other processing equipments. It also offers post
market services and support including equipment up gradation, spare parts,
maintenance services, and customer training. The company serves to more than 20
largest semiconductor manufacturers worldwide with more than 4,000 products. It
owns11 sales offices in seven countries. The company conducts its sales and
marketing activities from two locations in the United States. Outside of the
United States, its sales offices are located in Taiwan, South Korea, China,
Germany, Singapore and Italy. As for the fiscal year 2011,the company generated
68.6% of total revenue from its ten largest customers.Axcelis’s ion
implantation system provides entire range of high energy, high current and
medium current implanters for all application requirements. It’s wide range
of implant steps are defined by dose and energy. The medium current implanters
are made up of mid range energy and dose capabilities and these implanters are
called as single wafer systems.The high current implanters are made up of low
energy capability and high dose ranges while some of the high energy implanters
are made up of high energy range capabilities and low dose. The company
designes optima platform (single wafer implanters) to help the customers to
gain improved productivity, technical extendability, excellent process
performance and maximum application overlap.The optima products include the
optima HD, the optima XE and the optima MD. The optima HD are extendable for
ultra-low energy applications.This supports hydrogen and molecular implants for
the application of emerging dual poly gate and silicon-on-insulator to improve
device speed and performance.The optima XE unites RF Linac high energy, spot
beam technology with a high-speed, state-of-the-art single wafer endstation,
enabling unmatched throughput.The optima MD has its energy and dose
capabilities are extendable into traditional high current and high energy
spaces from traditional medium current space. For the fiscal year ended
December 2011, the total revenue of $319.4m was incurred from sales of ion
implantation products and related service of $237.9m, or 74.5% of total
revenue, compared with $232.4m, or 84.4%, of total revenue in 2010. The
company’s dry strip process prior to ion implementation process, develops
photoresist called stencil. Once the processes and steps are completed, the
photoresist is no longer necessary and must be removed.The process of removing
photoresist and residue is called dry strip.The company offers no damage low-k
dry strip solutions.Axcelis's dry strip products include Advanced
Cleaning/Strip, Integra ES; Standard Cleaning/Strip, Integra RS, RapidStrip
320; and Plasma Cleaning for Small Substrates, RapidStrip 210.Axcelis’s other
processing systems include photo-stabilization or curing system, and thermal
processing system.The photoresist stencil material spreads on the wafer must be
hardened or cured. It uses proprietary ultraviolet light sources to remove or
cure the photoresist during the implant processes and etch steps.The silicon
wafers are to be heated often to 900 degrees or more to complete the chemical
or electrical reactions.This process of heating called is rapid thermal
processing (RTP). The company focuses on product research and development
activities for bringing new products and services into the markets. Axcelis
uses 3D, computer-aided design, finite element analysis and other
computer-based modeling methods to test new designs though its research and
development.It owns a manufacturing facilities of 417,000 sq. ft in Beverly,
Massachusetts and ion implant and flat panel products at its 300,000 sq. ft
facility through the acquisition of the SEN Corporation.The company's service
and support business generated 46.2% of total revenue.It also generated 72.3%
of total revenue from export sales of the U.S manufacturig facilities to
foreign customers, sales by foreign subsidiaries and branches, and royalties.
It incurred an expenditure of $47.2m in the for research and development
activities in Rockville Maryland.Axcelis has its business operations in the US,
Europe and Asia Pacific regions. For the fiscal year ended December 2011, the
US contributed 73% of the total revenue of the company followed by, Asia
Pacific with 16.75% and Europe with 9.81% of the company's total revenue.In
January2012, the company entered into a strategic service partnership with
ULVAC TECHNO, Ltd. to support Axcelis semiconductor processing systems in
Japan. The agreement gives Axcelis
customers access to ULVAC TECHNO's vast service and support network in the
region, to ensure the highest levels of productivity and manufacturing
efficiency.Under the agreement, ULVAC TECHNO will provide a comprehensive
portfolio of service programs for Axcelis ion implantation, rapid thermal
processing, curing and cleaning systems in Japan.
Axcelis Technologies, Inc. (Axcelis) is an
equipment and service provider to the semiconductor manufacturing industry.
Axcelis operates its business under three major principles namely, technology
leadership, operational excellence and customer participation. The company
operatesa in Asia Pacific, the United States, Japan and Europe regions.Its
equipment manufacturing facility is in the United States, and supports its
customers with a worldwide network of 30 field offices in 11 countries.
Axcelis is headquartered in Massachusetts, the US.The company has significant
capital projects plans for 2012 and intends to invest not less than $2.5
million. Its future capital expenditures beyond 2012 depend on a number of
factors such as the timing and rate of expansion of its business and its
ability to generate cash to fund them.The company reported revenues of (U.S.
Dollars) USD 203.39 million during the fiscal year ended December 2012, a
decrease of 36.33% from 2011. The operating loss of the company was USD 30.94
million during the fiscal year 2012, as against an operating income of USD 7.13
million during 2011. The net loss of the company was USD 34.03 million during
the fiscal year 2012, as against a net profit of USD 5.08 million during 2011.
Axcelis
Technologies Inc. (Axcelis the Company we us or our) designs manufactures and
services ion implantation dry strip and other processing equipment used in the fabrication
of semiconductor chips. We sell to leading semiconductor chip manufacturers
worldwide. The ion implantation business comprised approximately 74.5% of our
revenue in 2011 with the remaining 25.5% of revenue derived from our dry strip
and other processing systems. In addition to equipment we provide extensive
aftermarket service and support including spare parts equipment upgrades
maintenance services and customer training.
Axcelis
Technologies, headquartered in Beverly, Mass., provides innovative,
high-productivity solutions for the semiconductor industry. The company is
dedicated to developing enabling process applications through the design,
manufacture and complete life cycle support of ion implantation, rapid thermal
processing, and cleaning and curing systems. Axcelis Technologies has key
product development centers in Beverly, Mass., as well as in Toyo, Japan
through its joint venture, SEN.
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Key Organizational Changes
Axcelis uses 3D, computer-aided
design, finite element analysis and other computer-based modeling methods to
test new designs though its research and development.It owns a manufacturing
facilities of 417,000 sq. ft in Beverly, Massachusetts and ion implant and flat
panel products at its 300,000 sq. ft facility through the acquisition of the
SEN Corporation.The company's service and support business generated 46.2% of
total revenue.It also generated 72.3% of total revenue from export sales of the
U.S manufacturig facilities to foreign customers, sales by foreign subsidiaries
and branches, and royalties. It incurred an expenditure of $47.2m in the for
research and development activities in Rockville Maryland. Axcelis has its
business operations in the US, Europe and Asia Pacific regions.
|
Location |
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108 Cherry Hill Dr |
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County: |
Essex |
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MSA: |
Boston, MA |
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Phone: |
978-787-4000 |
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Fax: |
978-787-3000 |
|
URL: |
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ABI©: |
429926165 |
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Annual Sales: |
$203,385,000 (USD) |
|
Employees: |
879 |
|
|
|
|
Facility Size(ft2): |
10,000 - 39,999 |
|
Facility Own/Lease: |
Own |
|
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Business Type: |
Public |
|
Location Type: |
Headquarter |
|
|
|
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Ticker: |
|
|
Exchange: |
NASDAQ |
|
Primary Line of Business: |
|
|
SIC: |
3559-34 - Semiconductor Manufacturing Equip (Mfrs) |
|
NAICS: |
333298 - All Other Industrial Machinery Mfg |
|
Secondary Lines of Business: |
|
|
NAICS: |
334413 - Semiconductors & Related Devices Mfg |
|
|
541613 - Marketing Consulting Svcs |
|
SICs: |
3674-01 - Semiconductor Devices (Mfrs) |
|
|
8742-13 - Marketing Programs & Services |
|
|
9999-66 - Federal Government Contractors |
|
Corporate Family |
Corporate
Structure News: |
|
|
Axcelis
Technologies Inc |
|
Axcelis Technologies Inc |
|
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|
Company Name |
Company
Type |
Location |
Country |
Industry |
Sales |
Employees |
|
Parent |
Beverly, MA |
United States |
Machinery and Equipment Manufacturing |
203.4 |
879 |
|
|
Joint Venture |
Tokyo |
Japan |
Electromedical and Control Instruments Manufacturing |
|
403 |
|
|
Subsidiary |
Hsin-chu |
Taiwan |
Machinery and Equipment Manufacturing |
|
70 |
|
|
Subsidiary |
Dresden |
Germany |
Machinery and Equipment Manufacturing |
|
60 |
|
|
Subsidiary |
Singapore |
Singapore |
Machinery and Equipment Manufacturing |
|
50 |
|
|
Subsidiary |
Aschheim, Bayern |
Germany |
Machinery and Equipment Manufacturing |
|
45 |
|
|
Subsidiary |
Hwasong, Kyonggi-Do |
Korea, Republic of |
Electronics Wholesale |
9.8 |
42 |
|
|
Axcelis
Technologies Semiconductor Trading (Shanghai) Co.,Ltd. |
Subsidiary |
Shanghai, Shanghai |
China |
Electronics Wholesale |
18.0 |
37 |
|
Branch |
Fishkill, NY |
United States |
Semiconductor and Other Electronic Component Manufacturing |
8.1 |
30 |
|
|
Branch |
Manassas, VA |
United States |
Semiconductor and Other Electronic Component Manufacturing |
4.7 |
16 |
|
|
Branch |
Richardson, TX |
United States |
Semiconductor and Other Electronic Component Manufacturing |
5.9 |
10 |
|
|
Branch |
Chandler, AZ |
United States |
Semiconductor and Other Electronic Component Manufacturing |
3.0 |
10 |
|
|
Branch |
Mc Lean, VA |
United States |
Semiconductor and Other Electronic Component Manufacturing |
2.9 |
10 |
|
|
Branch |
Lakeville, MN |
United States |
Semiconductor and Other Electronic Component Manufacturing |
2.8 |
10 |
|
|
Branch |
Boise, ID |
United States |
Machinery and Equipment Manufacturing |
2.5 |
10 |
|
|
Subsidiary |
Incheon |
Korea, Republic of |
Machinery and Equipment Manufacturing |
|
10 |
|
|
Branch |
Portland, OR |
United States |
Semiconductor and Other Electronic Component Manufacturing |
1.9 |
6 |
|
|
Branch |
Fremont, CA |
United States |
Semiconductor and Other Electronic Component Manufacturing |
1.5 |
5 |
|
|
Subsidiary |
Saint Ismier |
France |
Machinery and Equipment Manufacturing |
0.4 |
4 |
|
|
Branch |
Irvine, CA |
United States |
Semiconductor and Other Electronic Component Manufacturing |
1.5 |
3 |
|
|
Subsidiary |
London |
United Kingdom |
Miscellaneous Professional Services |
|
|
|
|
Subsidiary |
Bourne End |
United Kingdom |
|
|
|
|
|
Subsidiary |
Agrate Brianza |
Italy |
Machinery and Equipment Manufacturing |
|
|
|
Company Name |
Location |
Employees |
Ownership |
|
Applied Materials, Inc. |
Santa Clara, California, United States |
14,500 |
Public |
|
CollabRx Inc |
San Francisco, California, United States |
3 |
Public |
|
CVD Equipment Corporation |
Ronkonkoma, New York, United States |
171 |
Public |
|
Lam Research Corporation |
Fremont, California, United States |
6,600 |
Public |
|
Mattson Technology, Inc. |
Fremont, California, United States |
323 |
Public |
|
Nissin Electric Co., Ltd. |
Kyoto-Shi, Japan |
1,719 |
Public |
|
Novellus Systems, Inc. |
San Jose, California, United States |
2,855 |
Private |
|
PSK Inc |
Hwaseong, Korea, Republic of |
150 |
Public |
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SEN Corporation |
Tokyo, Japan |
333 |
Private |
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SPTS Technologies, Inc. |
San Jose, California, United States |
|
Private |
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TEL FSI, Inc. |
Chaska, Minnesota, United States |
354 |
Private |
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ULVAC Technologies, Inc. |
Methuen, Massachusetts, United States |
50 |
Private |
|
Varian Semiconductor Equipment Associates, Inc. |
Gloucester, Massachusetts, United States |
1,462 |
Private |
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Board of
Directors |
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Chairman of the Board, President, Chief Executive Officer |
Chairman |
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Independent Director |
Director/Board Member |
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Lead Independent Director |
Director/Board Member |
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Independent Director |
Director/Board Member |
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Independent Director |
Director/Board Member |
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Independent Director |
Director/Board Member |
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Independent Director |
Director/Board Member |
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Executives |
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Chairman of the Board, President, Chief Executive Officer |
Chief Executive Officer |
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Director |
Senior Management (General) |
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Vice President, Sales Executive |
Senior Management (General) |
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Operations, Vice President |
Senior Management (General) |
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Executive Vice President - Customer Operations |
Operations Executive |
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Customer Operations Manager |
Operations Executive |
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Operations |
Operations Executive |
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Manager, IT Operations |
Operations Executive |
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Senior Subcontracts Administrator |
Administration Executive |
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Executive Vice President - Human Resources/Legal, General Counsel, Corporate
Secretary |
Company Secretary |
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Chief Financial Officer |
Finance Executive |
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Senior Accounts Payable Manager |
Accounting Executive |
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Corporate Controller |
Controller |
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Employment Manager |
Human Resources Executive |
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Manager, Product Training |
Training Executive |
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Art Director |
Marketing Executive |
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Corporate Communications Executive |
Corporate Communications Executive |
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Chief Information Officer / Chief Technology Officer,
Telecommunications Executive |
Information Executive |
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VP, Chief Information Officer |
Information Executive |
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Electrical Systems Engineer |
Information Executive |
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Executive Vice President - Product Development, Engineering and
Marketing |
Engineering/Technical Executive |
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Engineering/Technical |
Engineering/Technical Executive |
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System Administrator |
Engineering/Technical Executive |
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Engineer |
Engineering/Technical Executive |
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Engineering/Technical |
Engineering/Technical Executive |
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Software Engineer |
Engineering/Technical Executive |
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Supplier Quality Engineer |
Engineering/Technical Executive |
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Senior Supplier Quality Engineer |
Engineering/Technical Executive |
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Engineer |
Engineering/Technical Executive |
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Unix System Administrator |
Engineering/Technical Executive |
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Quality Assurance Engineer |
Engineering/Technical Executive |
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Engineering/Technical |
Engineering/Technical Executive |
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Software Engineer |
Engineering/Technical Executive |
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Manager, Software Release |
Engineering/Technical Executive |
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General, Technical |
Engineering/Technical Executive |
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Database Administrator |
Engineering/Technical Executive |
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Engineering/Technical |
Engineering/Technical Executive |
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Engineering/Technical |
Engineering/Technical Executive |
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Engineering/Technical |
Engineering/Technical Executive |
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Engineering/Technical |
Engineering/Technical Executive |
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Engineering/Technical |
Engineering/Technical Executive |
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Senior Mechanical Engineer |
Engineering/Technical Executive |
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Senior Process Engineer Materials Specialist |
Engineering/Technical Executive |
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Engineering/Technical |
Engineering/Technical Executive |
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Engineering/Technical |
Engineering/Technical Executive |
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Engineering/Technical |
Engineering/Technical Executive |
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Senior Software Engi |
Engineering/Technical Executive |
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Software Engineer |
Engineering/Technical Executive |
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Vice President Product Development |
Product Management Executive |
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Product Marketing Manager |
Product Management Executive |
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Manager Business Development |
Business Development Executive |
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Vice President Business Development |
Business Development Executive |
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Logistics Analyst |
Logistics Executive |
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Facilities Manager |
Facilities Executive |
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Purchasing Agent |
Purchasing Executive |
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Quality Manager |
Quality Executive |
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Travel Planner |
Meeting/Travel Planner |
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Manager |
Other |
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Director Strategic Sourcing |
Other |
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Manager |
Other |
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Strategic Sourcing Manager |
Other |
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Manager |
Other |
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Axcelis
Technologies Inc Announces Appointment Of Kevin Brewer As Chief Financial
Officer Sep 16, 2013
Axcelis Technologies
Inc announced the appointment of Kevin J. Brewer as Executive Vice President
and Chief Financial Officer(CFO). Mr. Brewer, who has served as the Company's
interim CFO since July.
Axcelis
Technologies Inc Announces Retirement Of CFO Jun 20, 2013
Axcelis
Technologies Inc announced that Chief Financial Officer (CFO) Jay Zager will be
retiring from the company at the end of August, 2013. Effective July 1, 2013
Kevin Brewer will become Executive Vice President and Interim Chief Financial
Officer, continuing his role as executive vice president, global operations.
Zager will retain the title of Executive Vice President, Finance until his
retirement to facilitate a transition as the company conducts an external
search for a chief financial officer.
Axcelis
Technologies Inc Receives Follow-on Order For Optima HDx Jun 05, 2013
Axcelis
Technologies Inc announced that it has received a follow-on order for its
Optima HDx high current implanter from one of the chipmakers located in the
Asia Pacific region.
Axcelis
Technologies Inc Issues Q2 2013 Guidance In Line With Analysts'
Estimates-Conference Call May 02, 2013
Axcelis
Technologies Inc announced that for the second quarter of 2013, it expects
revenues to be in the $45 million to $50 million range, operating loss of
approximately $3.0 million to $6.0 million and an earnings loss of
approximately $0.03 to $0.05 per share. According to I/B/E/S Estimates,
analysts are expecting the Company to report revenue of $47 million, net income
of $(5.5) million and EPS of $(0.05) for the second quarter of 2013.
Axcelis
Technologies Inc Issues Q1 2013 Guidance-Conference Call Feb 04, 2013
Axcelis Technologies Inc announced that for first
quarter of 2013, it expects revenue to be in the range of $40-$50 million and
earnings loss per share (EPS) to be approximately $0.05-$0.07.
Axcelis Technologies Inc And Lam Research Corp
Announces Strategic Collaboration Agreement On Ion Implant, Dry-Strip, And Etch
Dec 04, 2012
Axcelis Technologies Inc and Lam Research Corp.,
announced a strategic collaboration agreement focusing on the interrelationship
between ion implantation, etch processes, and photoresist strip applications,
including material modification implants and high-dose implant strip (HDIS).
Separately, Axcelis decided that it will exit the dry-strip business and divest
dry-strip intellectual property and technology, including the advanced
non-oxidizing process technology of Integra product line, to Lam Research, allowing
Axcelis to focus exclusively on the ion implant market. Axcelis will continue
to ship 300 mm dry-strip products through August 2013, and support the Axcelis
installed base indefinitely, including all existing parts and service
contracts.