MIRA INFORM REPORT

Report Date :

10.10.2013

IDENTIFICATION DETAILS

Name :	MATTSON TECHNOLOGY, INC.

Registered Office :	47131 Bayside Parkway Fremont, CA 94538

Country :	United States

Financials (as on) :	31.12.2012

Date of Incorporation :	03.04.1997

Legal Form :	Public Parent

Line of Business :	Designs, Manufactures, Markets, and Globally supports semiconductor wafer processing equipment used in the fabrication of integrated circuits (ICs).

No. of Employees :	323

RATING & COMMENTS

MIRA’s Rating :

RATING		STATUS	PROPOSED CREDIT LINE
26-40	B	Capability to overcome financial difficulties seems comparatively below average.	Small

Status :	Moderate

Payment Behaviour :	Slow

Litigation :	Clear

NOTES:

Any query related to this report can be made on e-mail: infodept@mirainform.com while quoting report number, name and date.

ECGC Country Risk Classification List – March, 31^st,2013

Country Name

Previous Rating

(31.12.2012)

Current Rating

(31.03.2013)

United States

Risk Category	ECGC Classification
Insignificant	A1
Low	A2
Moderate	B1
High	B2
Very High	C1
Restricted	C2
Off-credit	D

UNITED STATES - ECONOMIC OVERVIEW

The US has the largest and most technologically powerful economy in the world, with a per capita GDP of $49,800. In this market-oriented economy, private individuals and business firms make most of the decisions, and the federal and state governments buy needed goods and services predominantly in the private marketplace. US business firms enjoy greater flexibility than their counterparts in Western Europe and Japan in decisions to expand capital plant, to lay off surplus workers, and to develop new products. At the same time, they face higher barriers to enter their rivals' home markets than foreign firms face entering US markets. US firms are at or near the forefront in technological advances, especially in computers and in medical, aerospace, and military equipment; their advantage has narrowed since the end of World War II. The onrush of technology largely explains the gradual development of a "two-tier labor market" in which those at the bottom lack the education and the professional/technical skills of those at the top and, more and more, fail to get comparable pay raises, health insurance coverage, and other benefits. Since 1975, practically all the gains in household income have gone to the top 20% of households. Since 1996, dividends and capital gains have grown faster than wages or any other category of after-tax income. Imported oil accounts for nearly 55% of US consumption. Crude oil prices doubled between 2001 and 2006, the year home prices peaked; higher gasoline prices ate into consumers' budgets and many individuals fell behind in their mortgage payments. Oil prices climbed another 50% between 2006 and 2008, and bank foreclosures more than doubled in the same period. Besides dampening the housing market, soaring oil prices caused a drop in the value of the dollar and a deterioration in the US merchandise trade deficit, which peaked at $840 billion in 2008. The sub-prime mortgage crisis, falling home prices, investment bank failures, tight credit, and the global economic downturn pushed the United States into a recession by mid-2008. GDP contracted until the third quarter of 2009, making this the deepest and longest downturn since the Great Depression. To help stabilize financial markets, in October 2008 the US Congress established a $700 billion Troubled Asset Relief Program (TARP). The government used some of these funds to purchase equity in US banks and industrial corporations, much of which had been returned to the government by early 2011. In January 2009 the US Congress passed and President Barack OBAMA signed a bill providing an additional $787 billion fiscal stimulus to be used over 10 years - two-thirds on additional spending and one-third on tax cuts - to create jobs and to help the economy recover. In 2010 and 2011, the federal budget deficit reached nearly 9% of GDP. In 2012 the federal government reduced the growth of spending and the deficit shrank to 7.6% of GDP. Wars in Iraq and Afghanistan required major shifts in national resources from civilian to military purposes and contributed to the growth of the budget deficit and public debt. Through 2011, the direct costs of the wars totaled nearly $900 billion, according to US government figures. US revenues from taxes and other sources are lower, as a percentage of GDP, than those of most other countries. In March 2010, President OBAMA signed into law the Patient Protection and Affordable Care Act, a health insurance reform that will extend coverage to an additional 32 million American citizens by 2016, through private health insurance for the general population and Medicaid for the impoverished. Total spending on health care - public plus private - rose from 9.0% of GDP in 1980 to 17.9% in 2010. In July 2010, the president signed the DODD-FRANK Wall Street Reform and Consumer Protection Act, a law designed to promote financial stability by protecting consumers from financial abuses, ending taxpayer bailouts of financial firms, dealing with troubled banks that are "too big to fail," and improving accountability and transparency in the financial system - in particular, by requiring certain financial derivatives to be traded in markets that are subject to government regulation and oversight. In December 2012, the Federal Reserve Board announced plans to purchase $85 billion per month of mortgage-backed and Treasury securities in an effort to hold down long-term interest rates, and to keep short term rates near zero until unemployment drops to 6.5% from the December rate of 7.8%, or until inflation rises above 2.5%. Long-term problems include stagnation of wages for lower-income families, inadequate investment in deteriorating infrastructure, rapidly rising medical and pension costs of an aging population, energy shortages, and sizable current account and budget deficits - including significant budget shortages for state governments.

Source : CIA

company name and address

MATTSON TECHNOLOGY, INC.

47131 Bayside Parkway

Fremont, CA 94538

United States




Tel:	510-657-5900
Fax:	510-492-5911
Toll Free:	(800) 628-8766

www.mattson.com

Employees:

323

Company Type:

Public Parent

Corporate Family:

8 Companies

Traded:

NASDAQ:

MTSN

Incorporation Date:

03-Apr-1997

Auditor:

PricewaterhouseCoopers LLP

Credit Rating:

A+ (100)

Financials in:	USD (In Millions)
Fiscal Year End:	31-Dec-2012
Reporting Currency:	US Dollar
Annual Sales:	126.5 ¹
Net Income:	(19.3)
Total Assets:	80.1 ²
Market Value:	139.9
	(27-Sep-2013)

Business Description

Mattson Technology, Inc. (Mattson Technology) designs, manufactures, markets, and globally supports semiconductor wafer processing equipment used in the fabrication of integrated circuits (ICs). The Company is a supplier of dry strip and rapid thermal processing (RTP) equipment to the global semiconductor industry. Its customer base includes foundries, memory and logic device manufacturers. The Companyâ€™s manufacturing equipment utilizes technology to deliver advanced processing capabilities and productivity for the fabrication of current and next-generation ICs. It has design and manufacturing centers in the United States, Germany and South Korea. Mattson's RTP products feature dual-sided, lamp-based heating technology that provides enhanced process uniformity and repeatability with precise process control for chip manufacturing. For the six months ended 30 June 2013, Mattson Technology, Inc. revenues decreased 48% to $44.8M. Net loss increased from $4.5M to $13.1M. Revenues reflect South Korea segment decrease of 88% to $2.3M, Europe segment decrease of 43% to $2.2M. Higher net loss reflects Restructuring charges increase of 72% to $2.7M (expense), Interest income (expense) Net decrease from $70K (income) to $121K (expense).

Industry

Industry	Machinery and Equipment Manufacturing
ANZSIC 2006:	2469 - Other Specialised Machinery and Equipment Manufacturing
ISIC Rev 4:	2819 - Manufacture of other general-purpose machinery
NACE Rev 2:	2829 - Manufacture of other general-purpose machinery n.e.c.
NAICS 2012:	333242 - Semiconductor Machinery Manufacturing
UK SIC 2007:	2829 - Manufacture of other general-purpose machinery n.e.c.
US SIC 1987:	3559 - Special Industry Machinery, Not Elsewhere Classified

Key Executives

(Emails Available)

Name	Title
Fusen Ernie Chen	President, Chief Executive Officer, Director
J. Michael Dodson	Chief Financial Officer, COO, Executive Vice President, Secretary
Hoang H Hoang	Senior Vice President of Global Customer Operations
Vicki Lowe	Sales Analyst
Patrick Riley	Planning Lead

Significant Developments

Topic	#*	Most Recent Headline	Date
Officer Changes	1	Mattson Technology Inc Appoints Dr. Fusen E. Chen As President And Chief Executive Officer	19-Feb-2013
Business Deals	1	Taiwan Semiconductor Manufacturing Co Ltd Acquires Equipment from Companies including TOKYO ELECTRON LTD and MATTSON TECHNOLOGY, INC	5-Dec-2012
Other Earnings Pre-Announcement	3	Mattson Technology Inc Issues Q3 2013 Guidance In Line With Analysts' Estimates-Conference Call	24-Jul-2013

* number of significant developments within the last 12 months

News

Title	Date
WIPO PUBLISHES PATENT OF AMAR B. KAMDAR, DAVID MALCOLM CAMM, MLADEN BUMBULOVIC, MATTSON TECHNOLOGY AND PETER LEMBESIS FOR "APPARATUS AND METHODS FOR... U.S. Fed News (247 Words)	4-Oct-2013
Stocks in Focus: Tower Group International, Ltd. (NASDAQ:TWGP), Real Goods Solar, Inc. (NASDAQ:RSOL), Rockwell Medical Inc , Mattson Technology, Inc SBWire (645 Words)	2-Oct-2013
Active Movers - Qiwi PLC (NASDAQ:QIWI), Direxion Shares Exchange Traded Fund Trust (NYSEARCA:DUST), Yelp Inc (NYSE:YELP), Mattson Technology, Inc. (NASDAQ:MTSN) SBWire (706 Words)	2-Oct-2013
Tuesday's Top Gainers: Edgen Group Inc (NYSE:EDG), Lexicon Pharmaceuticals, Inc. (NASDAQ:LXRX), Cree, Inc. (NASDAQ:CREE), Mattson Technology, Inc. (NASDAQ:MTSN) SBWire (615 Words)	1-Oct-2013
Stock to Watch: Mattson Technology Up 7.5% (MTSN) Individual.com (43 Words)	1-Oct-2013
Mattson Technology Up 7.5%, Shares Break Through Resistance (MTSN) TradingCharts.com (554 Words)	1-Oct-2013

Financial Summary

As of 30-Jun-2013

Key Ratios	Company	Industry
Current Ratio (MRQ)	1.77	3.16
Quick Ratio (MRQ)	0.84	1.74
Debt to Equity (MRQ)	0.0000	0.29
Sales 5 Year Growth	-13.89	6.76
Net Profit Margin (TTM) %	-32.49	8.43
Return on Assets (TTM) %	-31.04	7.34
Return on Equity (TTM) %	-63.73	12.34

Stock Snapshot

Traded: NASDAQ: MTSN

As of 27-Sep-2013

Financials in: USD

Recent Price	2.37	EPS	-0.27
52 Week High	2.55	Price/Sales	1.11
52 Week Low	0.70	Price/Book	3.21
Avg. Volume (mil)	0.45	Beta	3.17
Market Value (mil)	139.87

	Price % Change	Rel S&P 500%
4 Week	10.23%	6.40%
13 Week	8.22%	2.75%
52 Week	152.23%	115.77%
Year to Date	182.14%	137.85%

Corporate Overview

Location
47131 Bayside Parkway
Fremont, CA, 94538
Alameda County
United States

Tel:	510-657-5900
Fax:	510-492-5911
Toll Free Tel:	(800) 628-8766

www.mattson.com

Quote Symbol - Exchange
MTSN - NASDAQ

Sales USD(mil):	126.5
Assets USD(mil):	80.1
Employees:	323
Fiscal Year End:	31-Dec-2012

Industry:

Miscellaneous Capital Goods

Incorporation Date:	03-Apr-1997
Company Type:	Public Parent
Quoted Status:	Quoted


President, Chief Executive Officer, Director:	Fusen Ernie Chen

ABI Number: 834193666

1 - Profit & Loss Item Exchange Rate: USD 1 = USD 1
2 - Balance Sheet Item Exchange Rate: USD 1 = USD 1

Business Description

Mattson Technology, Inc. (Mattson Technology), incorporated in 1988, designs, manufactures, markets, and globally supports semiconductor wafer processing equipment used in the fabrication of integrated circuits (ICs). The Company is a supplier of dry strip and rapid thermal processing (RTP) equipment to the global semiconductor industry. Its customer base includes foundries, memory and logic device manufacturers. The Companyâ€™s manufacturing equipment utilizes technology to deliver advanced processing capabilities and productivity for the fabrication of current and next-generation ICs. It has design and manufacturing centers in the United States, Germany and South Korea. Mattson's RTP products feature dual-sided, lamp-based heating technology that provides enhanced process uniformity and repeatability with precise process control for chip manufacturing.

Dry Strip

Mattsonâ€™s Suprema strip system utilizes a wafer handling architecture to deliver productivity and ownership for manufacturing at the 65 nanometer node and below. The Suprema features its inductively coupled plasma (ICP) technology that offers resist strip capability to edge memory, logic and foundry customers. The Suprema has been installed at many of the global semiconductor companies for production and process development at advanced nodes.

The Company competes with Axcelis Technologies, Novellus Systems and PSK.

Rapid Thermal Processing

The Company's products include the Helios and Helios XP systems for conventional annealing applications and the Millios system for millisecond anneal applications (MSA). Its Helios and Helios XP systems are in volume production at memory customer sites. Millios, which features an arc lamp technology capable of reducing thermal cycle time, is designed to enable its customers to meet advanced gate anneal and activation process requirements through the 32 nanometer technology node and beyond.

The Company competes with Applied Materials, Dainippon Screen Manufacturing and Ultratech.

Etch

Etching is the process of removing any deposited materials or layers from the wafer's surface to create the desired pattern on the wafer's surface. Mattson Technology's etch products feature its Faraday-shielded ICP combined with selectable etch bias control to provide process on-wafer performance. Its etch products, the paradigmE and Alpine, are built on its high-throughput platform to provide low cost-of-ownership. It shipped paradigmE for dielectric and silicon etch applications to DRAM and NAND flash fabs.

The Company competes with Applied Materials, Lam Research and Tokyo Electron.

More Business Descriptions

Semiconductor Fabrication Equipment Designer, Mfr & Marketer

Establishments primarily engaged in manufacturing semiconductors and related solid- state devices. Important products of this industry are semiconductor diodes and stacks, including rectifiers, integrated microcircuits (semiconductor networks), transistors, solar cells, and light sensing and emitting semi-conductor (solid-state) devices.

Mattson Technology, Inc. (Mattson Technology) is a semiconductor equipment and product supplier. The company undertakes the designing, developing, manufacturing and supplying of various semiconductor wafer processing equipment, which are used in the fabrication of integrated circuits (ICs). Its products include dry strip equipment, rapid thermal processing systems, and anisotropic etch systems. Mattson Technology provides process engineering services, preventive maintenance service, product specific upgrade kits, and spares. Its customer base includes foundries, memory and logic device manufacturers. The company conducts its business operations through one reportable segment, which designs, manufactures and sells its fabrication equipment to the semiconductor manufacturers. It supplies dry strip, rapid thermal processing (RTP) and etch equipment to the semiconductor industry. Mattson Technologyâ€™s manufacturing equipment utilizes technology to deliver processing capabilities and productivity for the fabrication of current and next-generation ICs. Mattson Technologyâ€™s Suprema strip system utilizes a wafer handling architecture to deliver productivity and ownership for IC manufacturing. The Suprema features its inductively coupled plasma (ICP) technology that offers resist strip capability to edge memory, logic and foundry customers. The Suprema has been installed at many of the worldwide semiconductor companies for production and process development at 28nm and smaller technology nodes. The company's products include the Helios and Helios XP systems for conventional annealing applications and the Millios system for millisecond anneal applications (MSA). Its Helios and Helios XP systems are in volume production at memory customer sites. Millios features an arc lamp technology, which is capable of reducing thermal cycle time and it is designed for its customers to meet gate anneal and activation process requirements through the 32 nanometer technology node and beyond. Etching is the process of removing any deposited materials or layers from the wafer's surface to create the desired pattern on the wafer's surface. Mattson Technology's etch products feature its Faraday-shielded ICP combined with selectable etch bias control to provide process on-wafer performance. The companyâ€™s etch products includes paradigmE and Alpine. The paradigmE and Alpine systems are installed at semiconductor companies for production and process development at 20nm and smaller technology nodes. The company operates through its subsidiaries such as Mattson International, Inc., Mattson Technology Holdings, LLC, Mattson Wet Products, Inc., Mattson International Korea Co., Mattson International, GmbH, Mattson Thermal Products, GmbH, Mattson International France SARL, Mattson Technology Israel, Ltd, Mattson Trading (Shanghai) Co., Ltd., Mattson Technology Canada, Inc., and Mattson Technology Cayman Holdings, Ltd., among others. Mattson Technologyâ€™s research and development (R&D) activities include the development of its strip and RTP systems. The company has two R&D centers located in Fremont in California and Dornstadt in Germany. For the fiscal year ended December 2012, the company spent USD 22.32m, on research and development reflecting 17.6% of the company's total revenue. Geographically, it classifies its operations into five regions, namely, the US, Korea, Taiwan, Other Asia, and Europe and Others. For the fiscal year ended December 2012, the US region accounted for 13.8% of the company's total revenue, followed by Korea with 37.7%, Taiwan with 22.3%, Other Asia with 17.5% and Europe and Others with 8.4%.

Mattson Technology, Inc. (Mattson Technology) is a semiconductor equipment supplier. The company operates through one segment, which designs, manufactures and sells its fabrication equipment to the semiconductor manufacturers. It undertakes the designing, developing, manufacturing and supplying of various semiconductor wafer processing equipment, which are used in the fabrication of integrated circuits (ICs). Mattson Technology products include rapid thermal processing systems, dry strip equipment, and anisotropic etch systems. The companyâ€™s Suprema strip system exploits a wafer handling architecture. It is a supplier of dry strip and rapid thermal processing (RTP) equipment to the semiconductor industry worldwide. The company has offices located in France, China, Germany, Israel, Japan, Korea, Singapore, Taiwan and the US. Mattson Technology is headquartered in Fremont, California, the US.The company reported revenues of (U.S. Dollars) USD 126.53 million during the fiscal year ended December 2012, a decrease of 31.59% from 2011. The operating loss of the company was USD 19.28 million during the fiscal year 2012, as compared to an operating loss of USD 16.55 million during 2011. The net loss of the company was USD 19.32 million during the fiscal year 2012, as compared to a net loss of USD 17.95 million during 2011.

Mattson Technology Inc. designs manufactures and markets semiconductor wafer processing equipment used in the fabrication of integrated circuits. We are a leading supplier of plasma and rapid thermal processing equipment to the global semiconductor industry and operate in three primary product sectors: Dry Strip Rapid Thermal Processing and Etch. Through manufacturing and design innovation we have produced technologically advanced systems that provide productive and cost-effective solutions for customers fabricating current- and next-generation semiconductor devices.

Mattson Technology is a worldwide creator of dry strip and rapid thermal processing solutions essential to front-end fabrication of current-generation integrated circuits. The company ranks in top positions in the strip and in RTP market share worldwide and is a leader in the industry of strip and RTP technology. Mattson is vital to customers because it consistently delivers low total cost of ownership through proprietary process improvements, error reduction and elimination, better wafer-handling performance and increased yields. The company's manufacturing equipment utilizes technology to deliver advanced processing capability and high productivity for both 200- and 300-millimeter production at sub-90 nanometer technology nodes. Its customers include the top 20 worldwide IC manufacturers, and it has systems installed in major fabrication facilities throughout the world. Mattson Technology is headquartered in Fremont, Calif.

Product Codes

Product Code	Product Description
ZZZ-HC	Parent/Holding company

Financial Data

Financials in:	USD(mil)

Revenue:	126.5
Net Income:	-19.3
Assets:	80.1
Long Term Debt:	0.0
Total Liabilities:	36.8
Working Capital:	0.1

Date of Financial Data:	31-Dec-2012

1 Year Growth

-31.6%

-29.7%

Market Data

Quote Symbol:	MTSN
Exchange:	NASDAQ
Currency:	USD
Stock Price:	2.4
Stock Price Date:	09-27-2013
52 Week Price Change %:	152.2
Market Value (mil):	139,865.4

SEDOL:	2572295
ISIN:	US5772231008

Equity and Dept Distribution:
Common Stock $.001, 12/10, 120M auth., 54,440,000 issd., less 4,181,000 shs. in Treas. @ $38M. Insiders own 0.34%. IPO 6/95, 1.1M shares (325K by Co.) @ $45 by Hambrecht &Quist. PO: 3/00, 3M shs. @ $42.50 by Morgan Stanley Dean Witter. 10/95, 2-for-1 split.

Key Corporate Relationships

Auditor:	PricewaterhouseCoopers LLP

Auditor:	PricewaterhouseCoopers LLP

Additional Information

ABI Number:

834193666

The Strategic Initiatives report is created using technology to extract meaningful insights from analyst reports about a company's strategic projects and investments.

Strategic Initiatives

Partnerships
However, improvements in our results of operations and resulting cash position are largely dependent upon an improvement in the semiconductor equipment industry. The future success of our business will depend on numerous factors, including, but not limited to, the market demand for semiconductors and semiconductor wafer processing equipment. Such factors also will include our ability to (a) enhance our competitiveness and profitability; (b) develop and bring to market new products that address our customers' needs; (c) grow customer loyalty through collaboration with and support of our customers; (d) maintain a cost structure that will enable us to operate effectively and profitably throughout changing industry cycles; and (e) generate the gross profits necessary to enable us to make the necessary investments in our business.GlobalData uses a range of research techniques to gather and verify its information and analysis. These include primary research, in-house knowledge and expertise, proprietary databases, and secondary sources such as company websites, annual reports, SEC filings and press releases.
Planning
The semiconductor equipment industry typically is characterized by wide swings in operating results as the industry rotates between cycles. Demand also is becoming prone to seasonality due to the buying patterns of customers, which is dependent upon the consumer product industry. We have made progress in our strategic initiatives over the past several years and are strengthening our product positions. â€¢ In the etch market, during 2012, we further extended our position with our paradigmE system, as we added capabilities that improve on-wafer performance while keeping costs low. Our paradigmE systems continued to be released for production and development in the foundry/logic segments of the industry.

Location
47131 Bayside Pkwy Fremont, CA 94538-6517 United States

County:	Alameda
MSA:	San Fran, CA

Phone:	510-657-5900
Fax:	510-492-5911
URL:	http://mattson.com

ABI^©:	834193666

Annual Sales:	$126,526,000 (USD)
Employees:	323

Facility Size(ft²):	40,000+

Business Type:	Public
Location Type:	Headquarter

Ticker:	MTSN
Exchange:	NASDAQ

Primary Line of Business:
SIC:	3674-01 - Semiconductor Devices (Mfrs)
NAICS:	334413 - Semiconductors & Related Devices Mfg
Secondary Lines of Business:
NAICS:	333298 - All Other Industrial Machinery Mfg
	423610 - Electric Equip & Wiring Merchant Whols
	333319 - Other Commercial & Svc Machinery Mfg
	333999 - Misc General Purpose Machinery Mfg
SICs:	3559-09 - Special Industry Machinery NEC (Mfrs)
	3559-34 - Semiconductor Manufacturing Equip (Mfrs)
	3569-98 - General Ind Machinery/Equip NEC (Mfrs)
	5063-49 - Semiconductor-Mfrs' Equip/Supls (Whls)


Years in InfoUSA Database:	10+

Corporate Family

Corporate Structure News:

Total Corporate Family Members: 8

Company Name	Company Type	Location	Country	Industry	Sales (USD mil)	Employees
Mattson Technology, Inc.	Parent	Fremont, CA	United States	Machinery and Equipment Manufacturing	126.5	323
Mattson Thermal Products GmbH	Subsidiary	Dornstadt, Baden-WÃ¼rttemberg	Germany	Semiconductor and Other Electronic Component Manufacturing	30.5	100
Mattson Technology Singapore Pte. Ltd.	Subsidiary	Singapore	Singapore	Machinery and Equipment Manufacturing		29
Mattson Trading (Shanghai) Co., Ltd.	Subsidiary	Shanghai	China	Machinery and Equipment Manufacturing		22
Mattson Technology Japan K.K.	Subsidiary	Tokyo	Japan	Machinery and Equipment Manufacturing		4
Mattson Technology Holding GmbH	Subsidiary	Dornstadt, Baden-WÃ¼rttemberg	Germany	Machinery and Equipment Manufacturing		2
Mattson International GmbH	Subsidiary	Dornstadt, Baden-WÃ¼rttemberg	Germany	Miscellaneous Professional Services		10
Mattson Technology Israel Ltd.	Subsidiary	Migdal Ha'Emeq	Israel	Machinery and Equipment Manufacturing

Competitors Report

CompanyName	Location	Employees	Ownership
Applied Materials, Inc.	Santa Clara, California, United States	14,500	Public
Axcelis Technologies Inc	Beverly, Massachusetts, United States	879	Public
DAINIPPON SCREEN MFG. CO., LTD.	Kyoto-Shi, Japan	4,955	Public
Lam Research Corporation	Fremont, California, United States	6,600	Public
Novellus Systems, Inc.	San Jose, California, United States	2,855	Public
PSK Inc	Hwaseong, Korea, Republic of	150	Public
Tokyo Electron Limited	Minato-Ku, Japan	1,293	Public
Ultratech, Inc.	San Jose, California, United States	353	Public

Executives Report

Board of Directors

Name

Title

Function

Kenneth Kannappan

Chairman

Biography:

Mr. Kenneth Kannappan serves as an Independent Chairman of the Board of Mattson Technology Inc. He has served as a director since July 1998 and served as Chairman of the Board since July 2012 and from June 2008 to September 2011. Since January 1999, Mr. Kannappan has served as President and Chief Executive Officer of Plantronics, Inc., a telecommunications equipment manufacturer, and also serves as a member of its board of directors. From 1995 to 1998, Mr. Kannappan held various executive positions at Plantronics, Inc. Prior to joining Plantronics, Inc., Mr. Kannappan was Senior Vice President of Kidder, Peabody & Co. Incorporated, an investment banking company, from 1985 to 1995. From December 2000 to January 2008, Mr. Kannappan served as a director of Integrated Device Technology, Inc.

Source: Reuters

Age: 53

Education:

Yale University, BA (Economics)
Stanford University, MBA

Kenneth G. Smith

Vice Chairman

Vice-Chairman

Biography:

Mr. Kenneth G. Smith serves as Independent Vice Chairman of the Board of Mattson Technology Inc. He has served as a director since August 1994 and has served as Vice Chairman of the Board since July 2012. Mr. Smith has also served as Chairman of the Company's Compensation Committee since May 2011. Mr. Smith is a retired President, Chief Operating Officer and a Director of WaferTech, a semiconductor manufacturer where he served from May 1996 until April 2000. From 1991 to 1995, Mr. Smith was Vice President of Operations at Micron Semiconductor, Inc., a semiconductor manufacturer.

Age: 63

John C Bolger

Board Member

Director/Board Member

Biography:

Mr. Bolger became a director of Wind River in February 2000 in connection with Wind RiverG''s acquisition of Integrated Systems Inc. From July 1993 to February 2000 Mr. Bolger was a director of Integrated Systems Inc. and he is the retired Vice President of Finance and Administration & Secretary of Cisco Systems Inc. a networking systems company. Mr. Bolger is currently a private investor and a director of Cogent Inc. a biometric systems company; Integrated Device Technology Inc. a semiconductor manufacturer; and Mission West Properties a real estate investment trust. He holds a BA in English Literature from the University of Massachusetts and an MBA from Harvard University and is a certified public accountant.

Source: OneSourceWeb

Fusen Ernie Chen

President, Chief Executive Officer, Director

Director/Board Member

Biography:

Dr. Fusen Ernie Chen, Ph.D., serves as President, Chief Executive Officer, Director of Mattson Technology Inc. From September 2009 to June 2012, Dr. Chen was Executive Vice President at Novellus Systems, Inc. ("Novellus"), a semiconductor equipment manufacturer with responsibility for all product business units. From October 2005 to September 2009, Dr. Chen was the Chief Technology Officer at Novellus, with the responsibility for defining the company's technology strategy and direction. Prior to joining Novellus, Dr. Chen spent 10 years at Applied Materials, Inc., most recently as the group vice president and general manager for the company's copper physical vapor deposition and interconnect product business group. Dr. Chen earned his Ph.D. and B.S. degrees in materials science and engineering from the State University of New York and Tsing Hua University (Hsinchu, Taiwan), respectively.

Age: 53

Education:

State University of New York at Stony Brook, PHD (Materials Science and Engineering)
National Tsing Hua University, BS (Materials Science and Engineering)

Richard E. Dyck

Independent Director

Director/Board Member

Biography:

Mr. Richard E. Dyck serves as an Independent Director of Mattson Technology Inc. He has served as a director since January 2010. Mr. Dyck was the founder of and has since 2009 served as President of TGK, K.K., a supplier of connection systems for the testing of semiconductors. Mr. Dyck was the founder and President of TCS Japan K.K. and East Asia Connector Services, Ltd (Shanghai), manufacturers of high-speed connection systems, until their acquisitions in 2009. Mr. Dyck was the Vice-President and an Executive Officer of Teradyne, Inc., a semiconductor test equipment company, and the Chairman of Teradyne, Japan from 1982 until 1999. Mr. Dyck is a director of AvanStrate and a member of the Advisory Committee of the Japan External Trade Organization.

Age: 68

Education:

Harvard University, PHD (Sociology)
Harvard University, MA (Sociology)
California State University, BA

Scott Steuben Kramer

Independent Director

Director/Board Member

Reuters

Biography:

Mr. Scott Steuben Kramer serves as an Independent Director of Mattson Technology Inc. He has served as a director since September 2011. Mr. Kramer retired as vice president of manufacturing technology at SEMATECH, Inc. in 2011, a position he had held since 2008. Mr. Kramer held various positions of increasing responsibility at SEMATECH, from 1994 to 1997 and from 1998 to 2011. Prior to joining SEMATECH, he worked for LAM Research and IBM.

Age: 58

Education:

University of Utah, MBA
University of Missouri, BS (Mechanical Engineering)

Shigeru Nakayama

Board Member

Director/Board Member

Biography:

has served as a director since May 1996. Since 1996 Mr. Nakayama has been a business consultant to Semiconductor Equipment and Materials International an international association of semiconductor equipment manufacturers and materials suppliers. From 1984 to 1994 Mr. Nakayama was the President of SEMI Japan a member of Semiconductor Equipment and Materials International. Mr. Nakayamas experience with SEMI and his deep understanding of the semiconductor industry allow him to contribute an important international perspective regarding the Companys challenges and opportunities leading the Board to conclude that he should serve as a director.

Age: 76

D. Scott Peterson

Independent Director

Director/Board Member

Biography:

Mr. D. Scott Peterson serves as an Independent Director of Mattson Technology Inc. He has served as a director since December 2010. Mr. Peterson has also served as Chairman of the Company's Audit Committee since December 2010. Mr. Peterson was the Managing Partner of Ernst & Young's Pacific Northwest Area Assurance (Audit) Practice until his retirement in April 2010. In his various roles at Ernst & Young, Mr. Peterson served as the lead advisory partner for many of the firm's technology clients. He is a Certified Public Accountant. Mr. Peterson also served as a Practice Fellow at the Financial Accounting Standards Board from 1987 to 1989.

Age: 60

Tom St. Dennis

Director

Director/Board Member

Biography:

Mr. Thomas St. Dennis has been appointed as Director of Mattson Technology, Inc., with effect from September 9, 2013. Mr. St. Dennis has been the Chief Executive Officer and a Board Member of FormFactor, Inc. since September 2010. Mr. St. Dennis previously held various positions at Applied Materials, Inc. from 1992 to 1999 and again from 2005 to 2009. His most recent role at Applied Materials, Inc. was the Senior Vice President and General Manager of the Silicon Systems Group. From 2003 to 2005, Mr. St. Dennis held the position of Executive Vice President of Sales and Marketing at Novellus Systems, Inc.

Age: 59

Education:

University of California, Los Angeles, MS (Physics)
University of California, Los Angeles, BS (Physics)

Executives

Name

Title

Function

Fusen Ernie Chen

President, Chief Executive Officer, Director

Chief Executive Officer

Biography:

Age: 53

Education:

State University of New York at Stony Brook, PHD (Materials Science and Engineering)
National Tsing Hua University, BS (Materials Science and Engineering)

Rene George

General Manager Plasma Products Group

Division Head Executive

Neal A Holmlund

General Manager Operations

Division Head Executive

Biography:

Neal Holmlund is the Senior Vice President Operations at Mattson. Neal currently leads the companys global engineering supply chain quality and environmental health and safety groups. He joined Mattson in 2000 and has served as General Manager of the Surface Cleaning Group prior to his current role. Neal has over 20 years experience in management of capital equipment development and manufacturing both inside and outside the semiconductor equipment industry. He holds a BS degree in Chemical Engineering from Stanford University and an MBA from the Wharton School University of Pennsylvania.

Andreas Toennis

General Manager Thermal Products Group

Division Head Executive

Biography:

Andreas Toennis is the Senior Vice President and General Manager for the Thermal Products Division of Mattson Technology. He joined Mattson in 2002 and has served as Vice President of Technology Applications and Support. Andreas brings a wealth of knowledge and expertise to Mattson with more than twelve years of executive level experience within the capital equipment sector. Prior to coming to Mattson he served as Vice President of Operations at STEAG Electronic Systems before becoming President & COO of STEAG RTP Systems. Andreas is a graduate of the Universitat Karisruhe - Hochschule fuer Technik und Wirtschaft (Karlsruhe University of Applied Sciences) and received his graduate degree in Chemical Engineering. In addition he attended the USW European School of Business and Technology in Germany with continuing education programs at Stanford Graduate School of Business. Andreas has also served on SEMIs committee for the Strategic Business Conference.

J. Michael Dodson

Chief Financial Officer, COO, Executive Vice President, Secretary

Operations Executive

Biography:

Mr. J. Michael Dodson serves as Chief Financial Officer, Chief Operating Officer, Executive Vice President, Secretary of Mattson Technology Inc. Prior to joining the Company, Mr. Dodson served as Senior Vice President and Chief Financial Officer at DDi Corp., a provider of printed circuit board engineering and manufacturing services, from January 2010 until his resignation in October 2011. Before joining DDi Corp., Mr. Dodson served as a partner at Tatum, LLC, a provider of executive services on an interim or special project basis, from October 2009 to January 2010, and served from December 2005 to January 2009 as Senior Vice President and Chief Financial Officer with eTelecare Global Solutions, Inc., a provider of business process outsourcing services. Mr. Dodson holds a B.B.A degree from the University of Wisconsin-Madison.

Age: 52

Education:

University of Wisconsin, Madison, BBA (Accounting)

Compensation/Salary:$310,154

Compensation Currency: USD

Hoang H Hoang

Senior Vice President of Global Customer Operations

Operations Executive

Tyler Purvis

Chief Acctg Officer & Controller

Accounting Executive

Biography:

Mr. Purvis is the chief accounting officer and the controller of the company since 2012. Prior to this, he served as senior director, Worldwide Finance and Accounting; senior director, Finance and Treasury; and acting corporate controller of Blue Coat Systems, Inc., a provider of web security and WAN optimization solutions. Prior to this, he held positions as assistant corporate controller; director of Finance; and Sales and Marketing controller for Novellus Systems, Inc., a developer, manufacturer, seller and service provider of equipment used in the fabrication of integrated circuits. Mr. Purvis started his career at Ernst & Young, LLP, a public accounting firm, serving as an Audit Manager at the time of his departure.

Age: 38

Terri Peters

Benefits, Comp Senior Analyst

Benefits & Compensation Executive

Lisa Beck

Human Resources

Human Resources Executive

James Lee

Vice President Of Global Human Resources

Human Resources Executive

Biography:

James Lee Vice President of Global Human Resources joined Mattson in 2008 to provide Human Resource leadership in Asia. In February 2009 Mr. Lee took over the Global Human Resources leadership role. Prior to joining Mattson Mr. Lee was the Senior Director of Human Resources for Lam Research responsible for Human Resources development in Korea and Singapore with the focus of improving organizational capabilities in his region. Mr. Lee has also held leadership roles at Columbian Chemicals and Samsung Corning. He holds a Bachelors Degree in Public Administration from MyjongJi University Korea.

Vicki Lowe

Sales Analyst

Sales Executive

Randy Matsuda

Senior Vice President Global Business Op

International Executive

Biography:

Randy Matsuda is currently the Senior Vice President Global Business Operations at Mattson Technology.

Nigel Wenden

Senior Vice President Global Business Op

International Executive

Biography:

On August 10 2009 Mr. Wenden resigned his position as Senior Vice-President - Global Business Operations. The discussion of compensation programs in this Compensation Discussion and Analysis generally refers to compensation decisions made for Mr. Wenden prior to his resignation and reflects the general policies and decision-making processes of the Compensation Committee. Special compensation arrangements associated with the separation agreement are described immediately below and are reflected in the Summary Compensation Table which follows this Compensation Discussion and Analysis. In connection with Mr. Wendens resignation the Company entered into a Separation Agreement with him dated August 10 2009 (the Separation Agreement). Under the Separation Agreement Mr. Wenden received six months salary totaling $145000 plus an additional three months salary totaling $72500 upon signing a customary general release of claims against the Company.

Jeffrey Cue

Systems Engineering Manager

Information Executive

Matt Hough

Information Technology

Information Executive

Gary Hankins

Network Security

Network Management Executive

Abdulla Chekfa

Senior Software Staff Engineer